Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate

被引：6
作者：
Huang, Pin-Wei [1 ]
Wu, Zih-You [1 ]
Lee, Yin-Ku [1 ]
Chao, Chen-Sung [1 ]
Tsai, Su-Yueh [2 ]
Chang, Shou-Yi [1 ]
Duh, Jenq-Gong [1 ,3 ]
机构：
[1] Natl Tsing Hua Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
[2] Natl Tsing Hua Univ, Precis Instrument Ctr, Hsinchu, Taiwan
[3] 101 Sec 2,Kuang Fu Rd, Hsinchu 30013, Taiwan
来源：
MATERIALS CHEMISTRY AND PHYSICS | 2023年 / 298卷
关键词：
Thermo compression bonding; Microbump; Mechanical test; Intermetallic compound; Electron backscatter diffraction; SN INTERMETALLIC COMPOUNDS; SN-3.0AG-0.5CU SOLDER; INTERFACIAL REACTIONS; GRAIN-GROWTH; CU6SN5; ORIENTATION; JOINT; (CU; NI)(6)SN-5; BEHAVIOR; ALLOY;
D O I：
10.1016/j.matchemphys.2023.127392
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Survey on Cu-18Ni-18Zn substrate reacting with Sn-3.5Ag solder during different reflow times is carried out in this study. In microstructural observation, scallop-type Cu6Sn5 in traditional Cu/Sn/Cu system was replaced by layer-type (Cu,Ni)6(Sn,Zn)5 and Cu3Sn disappeared. Besides, granule-type Cu5(Sn,Zn)8 was revealed. Moreover, Zinc-rich layer could distinctively suppress the growth of IMCs and volume fraction of IMCs dramatically increased after it collapsed owing to prolonged reflow time. Nonetheless, with Ni and Zn addition, grain orientation was much diversified and average grain sizes in Cu-18Ni-18Zn samples was only about 300 nm, which was considerably reduced as compared to Cu samples. After shear testing, Cu-18Ni-18Zn/Sn-3.5Ag/ Cu-18Ni-18Zn samples are generally stronger than Cu/Sn-3.5Ag/Cu samples. An increase around 32% in shear strength with 150 seconds reflow process and an increase about 111% with 300 seconds reflow process were demonstrated. In short, Cu-18Ni-18Zn/Sn-3.5Ag/Cu-18Ni-18Zn system is a favorable option for advanced electronic packaging in near future.
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页数：8
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