Special Issue on COOL Chips

被引：0

作者：

Egawa, Ryusuke ^{[1
]}

Wada, Yasutaka ^{[2
]}

机构：

[1] Tokyo Denki Univ, Tokyo 1208551, Japan

[2] Meisei Univ, Tokyo 1918506, Japan

来源：

IEEE MICRO | 2024年 / 44卷 / 01期

关键词：

Special issues and sections; Low-power electronics; Chip scale packaging; High-speed electronics; Performance evaluation; Energy consumption;

D O I：

10.1109/MM.2024.3353949

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.

引用

页码：6 / 7

页数：2