Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging

被引：8
作者：
Liu, Jinxu [1 ,2 ]
Zhang, Jihua [1 ,2 ,3 ]
Gao, Libin [1 ,2 ]
Chen, Hongwei [1 ,2 ]
机构：
[1] Univ Elect Sci & Technol China, Sch Elect Sci & Engn, Chengdu 610054, Peoples R China
[2] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Device, Chengdu 610054, Peoples R China
[3] Chengdu Microtechnol Co Ltd, Chengdu 611731, Peoples R China
来源：
MICROMACHINES | 2023年 / 14卷 / 04期
关键词：
through-glass vias (TGVs); 3D glass packaging; vertical interconnection; transmission matrix (T-matrix);
D O I：
10.3390/mi14040803
中图分类号：
O65 [分析化学];
学科分类号：
070302 ; 081704 ;
摘要：
In order to effectively employ through-glass vias (TGVs) for high-frequency software package design, it is crucial to accurately characterize the S-parameters of vertical interconnection structures in 3D glass packaging. A methodology is proposed for the extraction of precise S-parameters using the transmission matrix (T-matrix) to analyze and evaluate the insertion loss (IL) and reliability of TGV interconnections. The method presented herein enables the handling of a diverse range of vertical interconnections, encompassing micro-bumps, bond-wires, and a variety of pads. Additionally, a test structure for coplanar waveguide (CPW) TGVs is constructed, accompanied by a comprehensive description of the equations and measurement procedure employed. The outcomes of the investigation demonstrate a favorable concurrence between the simulated and measured results, with analyses and measurements conducted up to 40 GHz.
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页数：8
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