Achieving high-quality silver sintered joint for highly-reliable schottky barrier diodes via pressureless method

被引：2

作者：

Dai, Chenyi ^{[1
]}

Wang, Yong ^{[1
]}

Lin, Pengrong ^{[1
,2
]}

Hao, Zilin ^{[1
]}

Wang, Chaoyang ^{[1
]}

Feng, Xiaocheng ^{[1
]}

Liu, Xueming ^{[1
]}

机构：

[1] Beijing Microelect Technol Inst, Beijing, Peoples R China

[2] Tsinghua Univ, Beijing, Peoples R China

来源：

FRONTIERS IN MATERIALS | 2023年 / 10卷

关键词：

silver sintered joint; schottky barrier diode; pressureless method; high-reliability; temperature cycling; LEAD-FREE SOLDER; LOW-TEMPERATURE; AG; NANOSILVER; COPPER; ALLOY; PASTE;

D O I：

10.3389/fmats.2023.1297827

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The fabrication of silver joints was done using the pressureless sintering technology to suit the demand of high-reliability schottky barrier diodes (SBD). Porosity of 10.6% and shear strength of 39.6 MPa were reached under the optimized parameters of 290 degrees C sintering temperature and 40 min residence time. The sintered joint demonstrated good mechanical/thermal/electrical performance in the ultimate reliability assessment testing, including the temperature cycling test, second sintering test, steady-state lifetime test, and intermittent lifetime test. This study demonstrated the viability of pressureless sintering of silver joints with good high-temperature reliability, which has significant application potential for aeronautical high-reliability power electronics.

引用

页数：8

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