A Boron-based Adhesion Aid for Efficient Bonding of Silicone Rubber and Epoxy Resin

被引:0
|
作者
Wang, Andong [1 ]
Zhou, Peng [1 ,2 ,3 ]
Tang, Xiaolin [1 ,2 ,3 ]
Yi, Shengping [1 ,2 ,3 ]
Zeng, Qihui [1 ]
Zhang, Zhiqiang [2 ]
Hu, Mingjie [1 ,2 ,3 ]
Liao, Jun [1 ,2 ,3 ]
Huang, Chi [1 ,2 ,3 ]
机构
[1] Wuhan Univ, Coll Chem & Mol Sci, Wuhan 430072, Peoples R China
[2] Hubei Key Lab Adv Aerosp Prop Technol, Wuhan 430040, Peoples R China
[3] Beijing Inst Technol, Adv Technol Res Inst Jinan, Jinan 250300, Peoples R China
来源
JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION | 2023年 / 38卷 / 03期
关键词
boron based adhesion promoter; epoxy resin composites; silicone rubber; adhesion mechanism; COMPOSITES; DERIVATIVES; CRYSTAL; FIBER;
D O I
10.1007/s11595-023-2751-z
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We improved the adhesion between silicon based insulating materials and epoxy resin composites by adding the adhesion promoter cycloborosiloxane (BSi, cyclo-1,3,3,5,7,7-hexaphenyl-1,5-diboro-3,7-disiloxane). The experimental results show that the addition of BSi in the silicone rubber (SR) system significantly increases the tensile shear strength between BSi and epoxy resin (EP), reaching 309% of the original value. On this basis, the mechanism of BSi to enhance the adhesion effect was discussed. The electron deficient B in BSi attracted the electron rich N and O in EP to enhance the chemical interaction, combined with the interfacial migration behavior in the curing process, to improve the adhesion strength. This study provides the design and synthesis ideas of adhesive aids, and a reference for further exploring the interface mechanism of epoxy resin matrix composites.
引用
收藏
页码:718 / 724
页数:7
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