A universal metasurface transfer technique for heterogeneous integration

被引:5
作者
Zhang, Xu [1 ]
Cai, Haogang [2 ,3 ]
Rezaei, Soroosh Daqiqeh [4 ,5 ]
Rosenmann, Daniel [6 ]
Lopez, Daniel [4 ]
机构
[1] Carnegie Mellon Univ, Dept Elect & Comp Engn, Pittsburgh, PA 15213 USA
[2] NYU Langone Hlth, Dept Tech4Health Inst, New York, NY 10016 USA
[3] NYU Langone Hlth, Dept Radiol, New York, NY 10016 USA
[4] Penn State Univ, Dept Elect Engn, University Pk, PA 16802 USA
[5] Penn State Univ, Mat Res Inst, University Pk, PA 16802 USA
[6] Argonne Natl Lab, Ctr Nanoscale Mat, Lemont, IL 60439 USA
关键词
heterogeneous integration; metasurface; nanofabrication; transfer; LENS;
D O I
10.1515/nanoph-2022-0627
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Metasurfaces offer a versatile platform for engineering the wavefront of light using nanostructures with subwavelength dimensions and hold great promise for dramatically miniaturizing conventional optical elements due to their small footprint and broad functionality. However, metasurfaces so far have been mainly demonstrated on bulky and planar substrates that are often orders of magnitude thicker than the metasurface itself. Conventional substrates not only nullify the reduced footprint advantage of metasurfaces, but also limit their application scenarios. The bulk substrate also determines the metasurface dielectric environment, with potentially undesired optical effects that undermine the optical performance. Here we develop a universal polymer-assisted transfer technique to tackle this challenge by decoupling the substrate employed on the fabrication of metasurfaces from that used for the target application. As an example, Huygens' metasurfaces with 120 nm thickness in the visible range (532 nm) are demonstrated to be transferred onto a 100 nm thick freestanding SiN x membrane while maintaining excellent structural integrity and optical performance of diffraction-limited focusing. This transfer method not only enables the thinnest dielectric metalens to the best of our knowledge, but also opens up new opportunities in integrating cascaded and multilayer metasurfaces, as well as the heterogeneous integration with nonconventional substrates and various electronic/photonic devices.
引用
收藏
页码:1633 / 1641
页数:9
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