Solute influence in transitions from non-Arrhenius to stick-slip Arrhenius grain boundary migration

被引:13
作者
Verma, Akarsh [1 ,3 ]
Johnson, Oliver K. [1 ]
Thompson, Gregory B. [2 ]
Ogata, Shigenobu [3 ]
Homer, Eric R. [1 ]
机构
[1] Brigham Young Univ, Dept Mech Engn, Provo, UT 84602 USA
[2] Univ Alabama, Dept Met & Mat Engn, Tuscaloosa, AL USA
[3] Osaka Univ, Grad Sch Engn Sci, Dept Mech Sci & Bioengn, Osaka, Japan
关键词
Grain boundary migration; Molecular dynamics; Nickel; Copper; Alloys; Solute resistance; Stick-Slip; MOLECULAR-DYNAMICS; ROUGHENING TRANSITION; CU-NI; COPPER; MOBILITY; SIGMA-3; MECHANISMS; METALS; GROWTH; ENERGY;
D O I
10.1016/j.actamat.2023.119605
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Synthetic driving force based molecular dynamics simulations are used to evaluate the grain boundary velocities for an incoherent sigma 3 [111] 60 degrees {11 8 5} GB in elemental nickel and its copper-based alloys in the dilute limit. We examine the effects of temperature, solute content, and magnitude of the driving force on grain boundary velocity trends and their associated mechanisms. We observe that, for pure nickel and its copper alloys in the dilute limit at high driving forces, these special grain boundaries exhibit non-Arrhenius or anti-thermal migration behavior, where temperature and grain boundary velocity are inversely related. For lower driving forces, the increased copper content leads to stick-slip migration behavior and a likely transition from non-Arrhenius to Arrhenius temperature dependence. Interestingly, the ordered atomic motions are frustrated but unchanged by the solute content and stick-slip migration. While the results are generally consistent with the Cahn-Lucke-Stuwe (CLS) model, no solute drag is observed; rather, the solute effects are likely the result of solute pinning.
引用
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页数:12
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