Analytical Fatigue Life Prediction of Ball Grid Array Solder Joints

This study evaluates the applicability of rapid life prediction methods of integrated circuit packages. Although computing power is becoming less of an issue, the complexity and inputs required for finite element analysis of electronics still need to be improved. We analyze the life estimation of ball grid array components using the Engelmaier model, compared to the closed-form Ansys Sherlock computer-aided engineering tool. The latter addresses some of the caveats of the analytical Engelmaier model. The study shows that the main advantage of the discussed analytical approaches is the fast assessment of parameter influence. However, validation is challenging due to the simplifications assumed in analytical life prediction models. Researchers and engineers should consider both the applicability and limitations of the approaches in the decision-making process.