Thermal switch for localized heating based on spatial electric field distribution regulation

被引：2

作者：

Zhou, Shangru ^{[1
,2
]}

Liu, Haojie ^{[1
]}

Ren, Jie ^{[1
]}

Tan, Jiahao ^{[1
]}

Ye, Yan ^{[1
]}

Zhang, Gaofeng ^{[1
]}

Li, Kun ^{[1
]}

Zheng, Huai ^{[3
,4
]}

Liu, Sheng ^{[3
,4
]}

机构：

[1] Changsha Univ, Coll Electromech Engn, Changsha 410022, Peoples R China

[2] Changsha Univ, Hunan Engn Res Ctr Res & Dev Degradable Mat & Mold, Changsha 410022, Peoples R China

[3] Wuhan Univ, Sch Power & Mech Engn, Wuhan 430072, Peoples R China

[4] Wuhan Univ, Inst Technol Sci, Wuhan 430072, Peoples R China

来源：

APPLIED PHYSICS LETTERS | 2023年 / 123卷 / 20期

基金：

中国国家自然科学基金;

关键词：

MEMS; FLOW;

D O I：

10.1063/5.0175410

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

At present, the thermal switch for localized heating is becoming a hot research topic in MEMS packaging technology. A method of using a liquid-based thermal switch is proposed in this paper. A plate local heating device based on electric field distribution control is constructed, where a thermal liquid column can be formed under the action of the electric field. The electric field controls the formation and dissipation of the liquid column to realize the on-off and off-on function of the thermal switch. Through the control of the different conductive substrates in the plate, the localized heat transfer can be further realized, and the heat transfer position is precisely regulated. Furthermore, due to the fluidity of the liquid, the prepared thermal switch can also realize movable heating. The experimental results show that the heating time and speed can be controlled precisely by adjusting the driven voltage and the conductive area of the upper substrate.

引用

页数：7

共 23 条

[1] Anisotropy-driven thermal conductivity switching and thermal hysteresis in a ferroelectric [J].

Antonio Seijas-Bellido, Juan ;

Iniguez, Jorge ;

Rurali, Riccardo .

APPLIED PHYSICS LETTERS, 2019, 115 (19)

[2] Thermal conductance switching based on the actuation of liquid droplets through the electrowetting on dielectric (EWOD) phenomenon [J].

Cha, Gilhwan ;

Kim, Chang-Jin ;

Ju, Y. Sungtaek .

APPLIED THERMAL ENGINEERING, 2016, 98 :189-195

[3] Evaluation of contacts for a MEMS thermal switch [J].

Cho, J. ;

Richards, C. ;

Bahr, D. ;

Jiao, J. ;

Richards, R. .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (10)

[4] Encrypted Thermal Printing with Regionalization Transformation [J].

Hu, Run ;

Huang, Shiyao ;

Wang, Meng ;

Luo, Xiaobing ;

Shiomi, Junichiro ;

Qiu, Cheng-Wei .

ADVANCED MATERIALS, 2019, 31 (25)

[5] Local heating realization by reverse thermal cloak [J].

Hu, Run ;

Wei, Xuli ;

Hu, Jinyan ;

Luo, Xiaobing .

SCIENTIFIC REPORTS, 2014, 4

[6] Efficient localized heating of silver nanoparticles by low-fluence femtosecond laser pulses [J].

Huang, H. ;

Sivayoganathan, M. ;

Duley, W. W. ;

Zhou, Y. .

APPLIED SURFACE SCIENCE, 2015, 331 :392-398

[7] Enhancement of flow in VARTM using localized induction heating [J].

Johnson, RJ ;

Pitchumani, R .

COMPOSITES SCIENCE AND TECHNOLOGY, 2003, 63 (15) :2201-2215

[8] Investigation of localized heating characteristics in selective ultrasonic imprinting [J].

Jung, Woosin ;

Lee, Hyun-Joong ;

Park, Keun .

INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2015, 16 (09) :1999-2004

[9] MEMS post-packaging by localized heating and bonding [J].

Lin, LW .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04) :608-616

[10] Heat and fluid flow in high-power LED packaging and applications [J].

Luo, Xiaobing ;

Hu, Run ;

Liu, Sheng ;

Wang, Kai .

PROGRESS IN ENERGY AND COMBUSTION SCIENCE, 2016, 56 :1-32

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