Recent Progress in Polymeric Flexible Surface Acoustic Wave Devices: Materials, Processing, and Applications

被引:7
|
作者
Lamanna, Leonardo [1 ]
机构
[1] Univ Salento, Dept Engn Innovat, Campus Ecotekne,Via Monteroni, I-73100 Lecce, Italy
关键词
Acoustic Devices; AlN; depostions; Flexible Electronics; Sensors; Thin Films; ZnO; PIEZOELECTRIC THIN-FILMS; DOPED ZNO FILMS; LOW-TEMPERATURE; HUMIDITY SENSORS; LABEL-FREE; BIOSENSOR; GROWTH; DEPOSITION; CELLS; OPTIMIZATION;
D O I
10.1002/admt.202300362
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Recently, there has been a remarkable increase in interest in piezoelectric thin films, particularly zinc oxide (ZnO) and aluminum nitride (AlN), deposited on flexible polymeric substrates. This is due to the rapid expansion of fields such as robotics, wearable devices, and the Internet of Things (IoT). These thin-film layered structures have a wide range of applications, such as energy harvesting, sensing and biosensing, microfluidic sorting, pumping and mixing, and telecommunications. One of the most promising platforms is piezoelectric acoustic-based thin-film devices on inexpensive, recyclable, or disposable polymeric substrates. Their reliability, reproducibility, conformability, small size, and wireless control capabilities make them a leading candidate for the development of new wireless, fully automated, and digitized microsystems for IoT and wearable devices. This review examines recent advancements in the engineering of ZnO and AlN thin films on polymeric, flexible, and conformable surface acoustic wave (SAW) devices. Topics covered include the materials used, piezoelectric film deposition, device fabrication, and the latest applications of this technology as sensors and actuators.
引用
收藏
页数:17
相关论文
共 50 条
  • [31] Application of Nanostructures in Electrochromic Materials and Devices: Recent Progress
    Wang, Jinmin
    Sun, Xiao Wei
    Jiao, Zhihui
    MATERIALS, 2010, 3 (12) : 5029 - 5053
  • [32] SURFACE ACOUSTIC WAVE DEVICES AND THEIR SENSING CAPABILITIES
    Avramescu, V.
    Bostan, C.
    Serban, B.
    Georgescu, I.
    Costea, S.
    Varachiu, N.
    Cobianu, C.
    CAS: 2009 INTERNATIONAL SEMICONDUCTOR CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2009, : 27 - 36
  • [33] Integrated Sensing and Actuation Capabilities of Flexible Surface Acoustic Wave Devices with Metallic and Polymer Layers
    Zahertar, Shahrzad
    Tao, Ran
    Torun, Hamdi
    Canyelles-Pericas, Pep
    Fu, Yong-Qing
    PROCEEDINGS OF THE 2021 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (FLEPS), 2021,
  • [34] Recent Progress in Nanostructured Functional Materials and Their Applications
    Yamamoto, Tomoyuki
    Yoshiya, Masato
    Hoang Nam Nhat
    MATERIALS TRANSACTIONS, 2020, 61 (12) : 2435 - 2441
  • [35] Recent developments in flexible thermoelectrics: From materials to devices
    Fan, Zeng
    Zhang, Yaoyun
    Pan, Lujun
    Ouyang, Jianyong
    Zhang, Qian
    RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2021, 137 (137)
  • [36] AlN-based surface acoustic wave resonators for temperature sensing applications
    Li, Chuan
    Liu, Xingzhao
    Shu, Lin
    Li, Yanrong
    MATERIALS EXPRESS, 2015, 5 (04) : 367 - 370
  • [37] Recent Progress of Flexible Image Sensors for Biomedical Applications
    Yokota, Tomoyuki
    Fukuda, Kenjiro
    Someya, Takao
    ADVANCED MATERIALS, 2021, 33 (19)
  • [38] Recent progress in conductive electrospun materials for flexible electronics: Energy, sensing, and electromagnetic shielding applications
    Mercante, Luiza A.
    Andre, Rafaela S.
    Facure, Murilo H. M.
    Correa, Daniel S.
    Mattoso, Luiz H. C.
    CHEMICAL ENGINEERING JOURNAL, 2023, 465
  • [39] Surface acoustic wave devices based on AlN/sapphire structure for high temperature applications
    Aubert, Thierry
    Elmazria, Omar
    Assouar, Badreddine
    Bouvot, Laurent
    Oudich, Mourad
    APPLIED PHYSICS LETTERS, 2010, 96 (20)
  • [40] Growth and Characterization of Polyimide-Supported AlN Films for Flexible Surface Acoustic Wave Devices
    Qi Li
    Hongyan Liu
    Gen Li
    Fei Zeng
    Feng Pan
    Jingting Luo
    Lirong Qian
    Journal of Electronic Materials, 2016, 45 : 2702 - 2709