A novel SiC high-k superjunction power MOSFET integrated Schottky barrier diode with improved forward and reverse performance

被引:6
|
作者
Kong, Moufu [1 ]
Hu, Zewei [1 ]
Yan, Ronghe [1 ]
Yi, Bo [1 ]
Zhang, Bingke [2 ]
Yang, Hongqiang [1 ]
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Device, Chengdu 610054, Peoples R China
[2] Power Semicond Res Inst, Beijing Inst Smart Energy, Beijing 102209, Peoples R China
基金
中国国家自然科学基金;
关键词
SiC; MOSFET; specific on-resistance; breakdown voltage; high-k; superjunction; switching performance; reverse recovery characteristic; CONTACT FORMATION; TRENCH MOSFET; DESIGN; DEVICES; TA2O5;
D O I
10.1088/1674-4926/44/5/052801
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
A new SiC superjunction power MOSFET device using high-k insulator and p-type pillar with an integrated Schottky barrier diode (Hk-SJ-SBD MOSFET) is proposed, and has been compared with the SiC high-k MOSFET (Hk MOSFET), SiC superjuction MOSFET (SJ MOSFET) and the conventional SiC MOSFET in this article. In the proposed SiC Hk-SJ-SBD MOSFET, under the combined action of the p-type region and the Hk dielectric layer in the drift region, the concentration of the N-drift region and the current spreading layer can be increased to achieve an ultra-low specific on-resistance (R (on,sp)). The integrated Schottky barrier diode (SBD) also greatly improves the reverse recovery performance of the device. TCAD simulation results indicate that the R (on,sp) of the proposed SiC Hk-SJ-SBD MOSFET is 0.67 m omega center dot cm(2) with a 2240 V breakdown voltage (BV), which is more than 72.4%, 23%, 5.6% lower than that of the conventional SiC MOSFET, Hk SiC MOSFET and SJ SiC MOSFET with the 1950, 2220, and 2220 V BV, respectively. The reverse recovery time and reverse recovery charge of the proposed MOSFET is 16 ns and18 nC, which are greatly reduced by more than 74% and 94% in comparison with those of all the conventional SiC MOSFET, Hk SiC MOSFET and SJ SiC MOSFET, due to the integrated SBD in the proposed MOSFET. And the trade-off relationship between the R (on,sp) and the BV is also significantly improved compared with that of the conventional MOSFET, Hk MOSFET and SJ MOSFET as well as the MOSFETs in other previous literature, respectively. In addition, compared with conventional SJ SiC MOSFET, the proposed SiC MOSFET has better immunity to charge imbalance, which may bring great application prospects.
引用
收藏
页数:9
相关论文
共 40 条
  • [1] Simulation Study of 4H-SiC High-k Pillar MOSFET With Integrated Schottky Barrier Diode
    Zheng, Ya Liang
    Tang, Wing Man
    Chau, Tony
    Sin, Johnny Kin On
    Lai, Peter T.
    IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2021, 9 : 951 - 957
  • [2] Performance enhancement of 4H-SiC superjunction trench MOSFET with extended high-K dielectric
    Yao, Jiafei
    Yang, Zhengfei
    Zhu, Yeqin
    Yao, Qing
    Chen, Jing
    Yang, Kemeng
    Li, Man
    Zhang, Maolin
    Zhang, Jun
    Guo, Yufeng
    MICROELECTRONICS JOURNAL, 2024, 151
  • [3] Improved reverse recovery characteristics obtained in 4H-SiC double-trench superjunction MOSFET with an integrated p-type Schottky diode
    Kotamraju, Siva
    Vudumula, Pavan
    IET CIRCUITS DEVICES & SYSTEMS, 2020, 14 (08) : 1283 - 1288
  • [4] SiC superjunction MOSFET with Schottky diode for improving short-circuit and reverse recovery ruggedness
    Cao, Wei
    Yin, Sujie
    Ge, Xinglai
    Liu, Dong
    MICRO AND NANOSTRUCTURES, 2024, 191
  • [5] A Novel 4H-SiC SGT MOSFET with Improved P plus Shielding Region and Integrated Schottky Barrier Diode
    Cao, Xiaobo
    Liu, Jing
    An, Yingnan
    Ren, Xing
    Yin, Zhonggang
    MICROMACHINES, 2024, 15 (07)
  • [6] The reverse recovery characteristics of an SiC superjunction MOSFET with a p-type Schottky diode embedded at the drain side for improved reliability
    Vudumula, Pavan
    Kotamraju, Siva
    JOURNAL OF COMPUTATIONAL ELECTRONICS, 2021, 20 (03) : 1187 - 1195
  • [7] The reverse recovery characteristics of an SiC superjunction MOSFET with a p-type Schottky diode embedded at the drain side for improved reliability
    Pavan Vudumula
    Siva Kotamraju
    Journal of Computational Electronics, 2021, 20 : 1187 - 1195
  • [8] Design and Process Analysis of a Split-Gate Trench Power MOSFET With Bottom-Trench High-k Pillar Superjunction for Enhanced Performance
    Jiang, Yunteng
    Xiao, Zhentao
    Zhang, Zonghao
    Zhang, Junchen
    Wang, Chenxing
    Li, Wenjun
    Huang, Haimeng
    Islam, Aynul
    Yang, Hongqiang
    IEEE ACCESS, 2025, 13 : 26676 - 26683
  • [9] Theory of an improved vertical power MOSFET using high-k insulator
    Huang, Mingmin
    Chen, Xingbi
    SUPERLATTICES AND MICROSTRUCTURES, 2015, 88 : 244 - 253
  • [10] Analysis and simulation of a 4H-SiC semi-superjunction Schottky barrier diode for softer reverse-recovery
    Cao Lin
    Pu Hong-Bin
    Chen Zhi-Ming
    Zang Yuan
    CHINESE PHYSICS B, 2012, 21 (01)