Three-in-one ITO-Cu-ITO based backplane circuit strategy for micro-LED display

被引：2

作者：

Pei, Jingxuan ^{[1
]}

Zhang, Zhiqiang ^{[1
,2
]}

Yu, Xiang ^{[1
]}

Yang, Lei ^{[1
]}

Zhang, Jing ^{[3
]}

Boukherroub, Rabah ^{[4
]}

Liu, Yayun ^{[5
,6
,7
]}

机构：

[1] China Univ Geosci, Sch Mat Sci & Technol, Beijing 100083, Peoples R China

[2] Beijing BOE Optoelect Technol Co Ltd, Prod Dev Ctr, Beijing 100176, Peoples R China

[3] Qilu Univ Technol, Adv Mat Inst, Jinan 250014, Peoples R China

[4] Univ Polytech Hauts De France, Univ Lille, CNRS, UMR 8520,Cent Lille,IEMN 15, F-59000 Lille, France

[5] CAS Key Lab Nanosyst & Hierarch Fabricat, Beijing 100190, Peoples R China

[6] Natl Ctr Nanosci & Technol, CAS Ctr Excellence Nanosci, Beijing 100190, Peoples R China

[7] Univ Chinese Acad Sci, Beijing 100049, Peoples R China

来源：

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING | 2023年 / 165卷

基金：

中国国家自然科学基金;

关键词：

Thin films; Sandwich structure; Electrical properties; Residual/internal stress; THERMAL-EXPANSION COEFFICIENT; SEED LAYER; COPPER; STRESS; ELECTRODEPOSITION; DEPOSITION; FILMS; SUBSTRATE; THICKNESS;

D O I：

10.1016/j.compositesa.2022.107330

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A three-in-one ITO-Cu-ITO multilayer wire strategy is developed to reliably fabricate large-size backplane circuit for micro-LED display. The multilayered wire was prepared by magnetron sputtering and electroplating, and presented a sandwich structure of ITOtransitional layer /Cu-seed layer /Cu-electroplating layer/ITOpassivation layer. Synergistic effect among the sandwiched layers endowed the coated wire with good electrical performance (2.31 x 10(-3) omega/sq), favorable adhesion (5B degree) and superior thickness uniformity (8 %), and could ensure reliable machining of glass-based backplane circuit. The fabricated multilayer wire facilitated the development of micro-LED backplane circuit, and was applicable to synthesize large-size (1.1 * 1.3 m(2)) glass backplane circuit. Field test of micro-LED circuit assembly proved the feasibility of the proposed backplane circuit strategy in production line. It is rational to believe that our strategy may offer a good avenue to upgrade traditional ITO and Cu materials for developing high-performance displays in scale production.

引用

页数：8