Impact of Diode Characteristics on 1.2 kV SiC MOSFET and Cascode JFET Efficiency: Body Diodes Vs SiC Schottky Barrier Diodes

被引:4
作者
Karout, Mohammed Amer [1 ]
Taha, Mohamed [1 ,2 ]
Fisher, Craig A. [1 ]
Deb, Arkadeep [1 ]
Mawby, Philip [1 ]
Alatise, Olayiwola [1 ]
机构
[1] Univ Warwick, Sch Engn, Coventry, W Midlands, England
[2] Cairo Univ, Fac Engn, Cairo, Egypt
来源
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC | 2023年
关键词
Body Diode; SiC Cascode JFET; SiC MOSFET; SiC Schottky Barrier Diode;
D O I
10.1109/APEC43580.2023.10131399
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the performance of 1.2kV SiC planar MOSFETs, Trench MOSFETs and 1.2 kV SiC Cascode JFETs is compared under 3 conditions. Firstly, the devices are switched with SiC Schottky Barrier Diodes (SBDs) with no contribution from the body diode (BD). Secondly, without SiC SBDs thus relying on the BD. And thirdly, with both SiC SBDs and BD in parallel (SBD+BD). Under the first condition, an auxiliary diode is required in series with the transistor to prevent BD operation in the 3rd quadrant. This contributes to additional conduction losses and has an impact on switching losses which are different between the different technologies. Simulations of a hard-switched converter have been used to compare the losses of these diode configurations with synchronous rectification (SR). The results show that the auxiliary diode is justified only for SiC Cascode JFET at high switching frequencies and the switching losses of the Trench MOSFET are unaffected by the diode configurations. For the Planar MOSFET, while using an SBD gives the best performance, there is no justification for the auxiliary diode. When the SBD is not used, SR is beneficial for all technologies except the Cascode JFET.
引用
收藏
页码:202 / 208
页数:7
相关论文
共 18 条
  • [1] Ahmed MR, 2017, IEEE ENER CONV, P5487, DOI 10.1109/ECCE.2017.8096916
  • [2] A Low-Loss Diode Integrated SiC Trench MOSFET for Improving Switching Performance
    Ding, Jiawei
    Deng, Xiaochuan
    Li, Songjun
    Wu, Hao
    Li, Xu
    Li, Xuan
    Chen, Wanjun
    Zhang, Bo
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2022, 69 (11) : 6249 - 6254
  • [3] Hou XY, 2016, 2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), P247, DOI 10.1109/WiPDA.2016.7799947
  • [4] Huang XX, 2018, IEEE ENER CONV, P1887, DOI 10.1109/ECCE.2018.8558472
  • [5] An Analysis of the Switching Performance and Robustness of Power MOSFETs Body Diodes: A Technology Evaluation
    Jahdi, Saeed
    Alatise, Olayiwola
    Bonyadi, Roozbeh
    Alexakis, Petros
    Fisher, Craig A.
    Gonzalez, Jose A. Ortiz
    Ran, Li
    Mawby, Philip
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2015, 30 (05) : 2383 - 2394
  • [6] High-Voltage Hybrid IGBT Power Modules for Miniaturization of Rolling Stock Traction Inverters
    Li, Xiang
    Li, Daohui
    Chang, Guiqin
    Gong, Wei
    Packwood, Matthew
    Pottage, Daniel
    Wang, Yangang
    Luo, Haihui
    Liu, Guoyou
    [J]. IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2022, 69 (02) : 1266 - 1275
  • [7] Low-Reverse Recovery Charge Superjunction MOSFET With a p-Type Schottky Body Diode
    Lin, Zhi
    Hu, Shengdong
    Yuan, Qi
    Zhou, Xichuan
    Tang, Fang
    [J]. IEEE ELECTRON DEVICE LETTERS, 2017, 38 (08) : 1059 - 1062
  • [8] Martin D, 2017, APPL POWER ELECT CO, P2297, DOI 10.1109/APEC.2017.7931020
  • [9] Martin D, 2016, 2016 IEEE 4TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), P242, DOI 10.1109/WiPDA.2016.7799946
  • [10] Nayak D., 2020, 2020 IEEE INT C POWE, P1