A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

With the development of integrated and ultra-thin portable electronics, the ultimate heat dissipation power in extremely narrow spaces (<1 mm) is increasing year by year. However, the current critical power of ultra-thin vapor chamber (UTVC) is still at a low level, which hinders the development of high-power portable electronic products. In this study, novel UTVCs with a thickness of only 0.5 mm are prepared by utilizing the composite capillary wick. Different from the traditional multi-layer 2D copper mesh wick, the composite (CA/CB) wick is composed of multi-layer 2D copper mesh and 3D spiral woven mesh. UTVCs prepared from three different wicks, referred as to 2D-UTVC, CA-UTVC, CB-UTVC, were compared. Under different working conditions, the CA/CBUTVC has better heat transfer performance than 2D-UTVC. In the horizontal state, the maximum effective thermal conductivity (Keff) of CA-UTVC and CB-UTVC is significantly improved by 86.8% and 60.2% compared to that of reference 2D-UTVC. The CA design is recommended for low heating power within 40 W, while the CB design is the optimal choice for high heating power above 40 W. The maximum critical power of CB-UTVC is up to 60 W with gravity support. Even at 50 W under anti-gravity condition, the thermal conductivity of CB-UTVC is still up to 11817.1 W/(m K), which is 29.5 times that of copper. The improved heat dissipation is due to the enhanced capillary force of the composite wick. This positive effect is facilitated by the combination of multiple 3D spiral woven meshes in the CB design. The optimized UTVC effectively reduces the maximum temperature by 14.3 degrees C compared to copper sheet under natural convection at 10 W heating power. The novel UTVC could provide a guarantee for the heat dissipation of high-power integrated portable electronic devices in the future.