共 10 条
- [1] Robust Hot Via Interconnect Technique with Silver Epoxy for GaAs MMIC [J]. PROCEEDINGS OF THE 2021 IEEE NATIONAL AEROSPACE AND ELECTRONICS CONFERENCE (NAECON), 2021, : 195 - 199
- [2] Boles T, 2017, IEEE INT CONF MICROW, P18
- [3] Brogle JJ, 2017, EUR MICROW INTEGRAT, P109, DOI 10.23919/EuMIC.2017.8230672
- [4] Brogle JJ, 2014, 2014 9TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE (EUMIC), P69, DOI 10.1109/EuMIC.2014.6997793
- [5] Kumar GA, 2012, 2012 5TH INTERNATIONAL CONFERENCE ON COMPUTERS AND DEVICES FOR COMMUNICATION (CODEC)
- [6] Sharma Updesh, 2018, 2018 2nd International Conference on Micro-Electronics and Telecommunication Engineering (ICMETE), P49, DOI 10.1109/ICMETE.2018.00024
- [7] Shigematsu T, 1997, IEEE MTT-S, P527, DOI 10.1109/MWSYM.1997.602847
- [8] Thome F., 2016, 2016 IEEE MTT S INT, P1
- [9] A Low-Loss 50-70 GHz SPDT Switch in 90 nm CMOS [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2010, 45 (10) : 2003 - 2007
- [10] Vassilev V, 2021, 2021 INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (ISAP)