Experimental Pool Boiling Heat Transfer Analysis with Copper-Alumina Micro/Nanostructured Surfaces Developed by a Novel Electrochemical Deposition Technique

The rapid latent heat transfer in boiling heat transfer directs its potential use in a variety of heat transfer devices. A new four-step electrodeposition technique is recommended for the development of the micro-nanostructured surface of Cu-Al2O3 nanoparticles (higher thermal conductive) to increase pool boiling heat transfer performance. The nanoparticles deposited at lower current density have increased the nucleation density and the two-step sintering has improved the physical properties of deposited nanoparticles. Thus, apart from cost effectiveness, reliability, and simplicity, the electrodeposition method is able to provide more stable micro-nanostructured surface. Therefore, the method offered in this work is a proficient method for the development of micro-nanostructured surfaces. After carrying out the surface characterization of structured surfaces, the boiling heat transfer performance is studied through experimentations. The influence of different parameters on pool boiling heat transfer (PBHT) enhancement is also analyzed. Based on the study of the achieved results, it is inferred that the fabricated micro-nanostructured surfaces are uniform in structure, achieve higher critical heat flux (92 %), and PBHT coefficient (6.1 times). Thus, the proposed heating surfaces may be considered as a prospective candidate for the cooling of microelectronics devices.