TexSe1-x Photodiode Shortwave Infrared Detection and Imaging

被引:36
作者
Fu, Liuchong [1 ]
He, Yuming [1 ]
Zheng, Jiajia [1 ,2 ]
Hu, Yuxuan [1 ,2 ]
Xue, Jiayou [1 ,2 ]
Li, Sen [1 ]
Ge, Ciyu [1 ]
Yang, Xuke [1 ]
Peng, Meng [1 ]
Li, Kanghua [1 ]
Zeng, Xiangbin [1 ]
Wei, Jinchao [3 ]
Xue, Ding-jiang [3 ]
Song, Haisheng [1 ]
Chen, Chao [1 ,2 ]
Tang, Jiang [1 ,2 ]
机构
[1] Huazhong Univ Sci & Technol, Sch Opt & Elect Informat SOEI, Wuhan Natl Lab Optoelect WNLO, Wuhan 430074, Hubei, Peoples R China
[2] Huazhong Univ Sci & Technol, China EU Inst Clean & Renewable Energy, Wuhan 430074, Hubei, Peoples R China
[3] Chinese Acad Sci, Inst Chem, Beijing Natl Lab Mol Sci, Key Lab Mol Nanotechnol, Beijing 100190, Peoples R China
基金
国家重点研发计划; 中国国家自然科学基金;
关键词
imaging; infrared detection; photodiodes; Te-Se alloy; COLLOIDAL QUANTUM DOTS; SOLAR-CELLS; SEMICONDUCTOR SELENIUM; BAND-GAP; TELLURIUM; PERFORMANCE; NANOTUBES; GROWTH; PHOTODETECTOR; DEPENDENCE;
D O I
10.1002/adma.202211522
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Short-wave infrared detectors are increasingly important in the fields of autonomous driving, food safety, disease diagnosis, and scientific research. However, mature short-wave infrared cameras such as InGaAs have the disadvantage of complex heterogeneous integration with complementary metal-oxide-semiconductor (CMOS) readout circuits, leading to high cost and low imaging resolution. Herein, a low-cost, high-performance, and high-stability TexSe1-x short-wave infrared photodiode detector is reported. The TexSe1-x thin film is fabricated through CMOS-compatible low-temperature evaporation and post-annealing process, showcasing the potential of direct integration on the readout circuit. The device demonstrates a broad-spectrum response of 300-1600 nm, a room-temperature specific detectivity of 1.0 x 10(10) Jones, a -3 dB bandwidth up to 116 kHz, and a linear dynamic range of over 55 dB, achieving the fastest response among Te-based photodiode devices and a dark current density 7 orders of magnitude smaller than Te-based photoconductive and field-effect transistor devices. With a simple Si3N4 packaging, the detector shows high electric stability and thermal stability, meeting the requirements for vehicular applications. Based on the optimized TexSe1-x photodiode detector, the applications in material identification and masking imaging is demonstrated. This work paves a new way for CMOS-compatible infrared imaging chips.
引用
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页数:12
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