Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn-Bi by grain boundary diffusion with the grain growth at solid-state temperatures

The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples was conducted in the temperature range of 363-393 K for various times up to 384 h. In the diffusion couple, an intermetallic layer composed of Cu6Sn5 with irregular scallop shapes and Cu3Sn with relatively uniform thickness forms at the Cu/(Sn-Bi) interface. Isothermal sections of the equilibrium phase diagram in the ternary Bi-Cu-Sn system were calculated at the isothermal annealing temperatures and the peak temperature of the reflow process by a CALPHAD (calculation of phase diagrams) method. The diffusion path passes through the three-phase tie-triangle, including Cu6Sn5 and Cu3Sn. The obtained thicknesses were plotted against the annealing time, and a power function equation was found to describe their relationship. The values of the exponent in the power function were close to 0.25, indicating that the layer growth was predominantly controlled by boundary diffusion with the grain growth. Furthermore, the exponent values were relatively insensitive to the annealing temperature. The relationship between the exponent and the annealing temperature was analyzed, and it was concluded that the grain growth in the intermetallic layer followed a parabolic law. The growth and morphology evolution of the intermetallic compound and Sn-Bi eutectic microstructure at the interface were depicted, shedding light on the widening of the eutectic microstructure. Additionally, the activation enthalpy for the rate-controlling process of intermetallic layer growth at solid-state temperatures was evaluated using a least-squares method, providing insights into the energy barrier for the diffusion or transport of atoms across the interface. This study contributes to a better understanding of intermetallic layer formation and growth in Cu/(eutectic Sn-Bi) diffusion couples, offering valuable information for developing reliable solder joints and high-temperature solders.