Construction of a dual heterogeneous lamella structure to improve the electrical conductivity and mechanical properties of Cu alloys

被引：3
|
作者：
Li, Shaoyu [1 ]
Luo, Xingrui [1 ]
Sun, Zhe [1 ]
Zhou, Huarui [1 ]
Xiong, Shiyu [1 ]
Liu, Baixiong [1 ,2 ]
Zeng, Longfei [1 ,2 ]
Yang, Bin [1 ]
机构：
[1] Jiangxi Univ Sci & Technol, Fac Mat Met & Chem, Ganzhou 341000, Peoples R China
[2] Jiangxi Adv Copper Ind Res Inst, Yingtan 335000, Peoples R China
来源：
MATERIALS LETTERS | 2023年 / 338卷
基金：
中国博士后科学基金; 中国国家自然科学基金;
关键词：
Dual heterogeneous lamella structure; Cu based materials; Strength -electrical conductivity; Back -stress strengthening; STRENGTH; GRADIENT;
D O I：
10.1016/j.matlet.2023.134016
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Copper (Cu) based materials desire superior mechanical properties and high conductivity for potential industry application. In this work, a specially designed dual heterogeneous lamella structure (DHLS) was produced in Cu alloy by powder metallurgy and deformation heat treatment. It is characterized by soft micrograined lamellae embedded inside a hard matrix of ultrafine grains containing nano-sized precipitations. Such dramatic microstructure heterogeneities produce strong back stress hardening, which led to substantially improved ultimate tensile strength (530.5 MPa) without greatly sacrificing the original ductility. In addition, the recrystallization of micrograined lamellae and the aging precipitation of ultrafine grains result in the high conductivity. This study offers a workable strategy to using DHLS to optimize the comprehensive Cu-based materials with an excellent strength-electrical conductivity combination.
引用
收藏
页数：4
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