An automatic defect detection method for TO56 semiconductor laser using deep convolutional neural network

被引:17
作者
Zhang, Hang [1 ,2 ]
Li, Rong [1 ]
Zou, Dexiang [1 ]
Liu, Jian [1 ]
Chen, Ning [1 ]
机构
[1] Hunan Univ, Coll Mech & Vehicle Engn, Changsha 410082, Peoples R China
[2] Changsha Univ Sci & Technol, Coll Automot & Mech Engn, Changsha 410114, Peoples R China
关键词
Deep convolutional neural network; Defect detection; Image segmentation; Semiconductor laser; TO56;
D O I
10.1016/j.cie.2023.109148
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
Accurate and reliable automatic defect detection of semiconductor laser plays an important role in the application and development of optical communication technology, but the traditional methods cannot meet the increasing requirements of defect detection of semiconductor lasers. In this study, an automatic three-stage defect detection method is proposed for the most widely used semiconductor laser TO56. The key defect detection tasks of TO56 include the sintering status detection of LD and PD and the connection reliability detection of four gold wires. In the stage I of the proposed method, the captured TO56 image is judged whether the chips and wires have been sintered by the object detection algorithm, and the wire images are extracted. Then in the stage II, the extracted wire images are segmented by the image segmentation algorithm. Finally, in the stage III, the category pattern recognition is performed based on the segmentation results. Moreover, to further improve the effectiveness of the proposed method, the object detection algorithm adopted in the stage I and the image segmentation algorithm adopted in the stage II are optimized. The experimental results demonstrate that the proposed method can accurately and automatically detect the defects of TO56, and the accuracy reaches 98.85 %.
引用
收藏
页数:14
相关论文
共 54 条
[1]   Using infrared thermal responses for PCBA production tests: Feasibility study [J].
Alaoui, Nabil El Belghiti ;
Cassou, Anais ;
Tounsi, Patrick ;
Boyer, Alexandre ;
Viard, Arnaud .
MICROELECTRONICS RELIABILITY, 2019, 100
[2]   Improved Normalized Cross-Correlation for Defect Detection in Printed-Circuit Boards [J].
Annaby, M. H. ;
Fouda, Y. M. ;
Rushdi, M. A. .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2019, 32 (02) :199-211
[3]  
[Anonymous], 2014, INT C LEARN REPR ICL
[4]  
[Anonymous], 2015, ICLR
[5]   A quantitative model for the bipolar amplification effect: A new method to determine semiconductor/oxide interface state densities [J].
Ashton, James P. ;
Moxim, Stephen J. ;
Purcell, Ashton D. ;
Lenahan, Patrick M. ;
Ryan, Jason T. .
JOURNAL OF APPLIED PHYSICS, 2021, 130 (13)
[6]   NB-CNN: Deep Learning-Based Crack Detection Using Convolutional Neural Network and Naive Bayes Data Fusion [J].
Chen, Fu-Chen ;
Jahanshahi, Mohammad R. .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2018, 65 (05) :4392-4400
[7]   Encoder-Decoder with Atrous Separable Convolution for Semantic Image Segmentation [J].
Chen, Liang-Chieh ;
Zhu, Yukun ;
Papandreou, George ;
Schroff, Florian ;
Adam, Hartwig .
COMPUTER VISION - ECCV 2018, PT VII, 2018, 11211 :833-851
[8]   DeepLab: Semantic Image Segmentation with Deep Convolutional Nets, Atrous Convolution, and Fully Connected CRFs [J].
Chen, Liang-Chieh ;
Papandreou, George ;
Kokkinos, Iasonas ;
Murphy, Kevin ;
Yuille, Alan L. .
IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 2018, 40 (04) :834-848
[9]  
Chen LB, 2017, IEEE INT SYMP NANO, P1, DOI 10.1109/NANOARCH.2017.8053709
[10]   A real-time surface inspection system for precision steel balls based on machine vision [J].
Chen, Yi-Ji ;
Tsai, Jhy-Cherng ;
Hsu, Ya-Chen .
MEASUREMENT SCIENCE AND TECHNOLOGY, 2016, 27 (07)