Effect of In Addition on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.8Zn/Cu Solder Joints

被引：1
作者：
Tu, Wenbin [1 ]
Wang, Shanlin [1 ]
Chen, Yuhua [1 ]
He, Like [1 ]
Yang, Chenggang [1 ]
Ke, Liming [1 ]
机构：
[1] Nanchang Hangkong Univ, Jiangxi Key Lab Forming & Joining Technol Aerosp C, Nanchang 330063, Peoples R China
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2023年 / 52卷 / 07期
关键词：
Lead-free solder; In; wettability; shear strength; SN-AG-CU; LEAD-FREE SOLDER; SN-0.7CU SOLDER; INTERFACIAL REACTIONS; ZN; BI; ALLOYS; IMPROVEMENT; EVOLUTION; BEHAVIOR;
D O I：
10.1007/s11664-023-10371-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The effect of In addition on the microstructures, hardness, melting characteristics, wettability, thickness of intermetallic compounds (IMC), and shear strength of Sn-0.7Cu-0.8Zn Pb-free solder joints has been investigated. The results showed that the melting point and hardness of the solder decreased and increased, respectively, as the In content increased, and that the spreading area first increased and then decreased with increasing In content. The microstructure of the Sn-0.7Cu-0.8Zn solder joint was composed of beta-Sn, coarse Cu6Sn5, Cu-Zn, and Cu6Sn5/Sn eutectic phases. Although the type of microstructure in the solder joint was not changed by the addition of In, the microstructure was refined. The shear strength of the welded joint increased as the In content increased, which is related to the combined effect of microstructure refinement, second-phase strengthening, and solution strengthening. The Sn-0.7Cu-0.8Zn solder with the addition of 3.5 wt.% In exhibited the best comprehensive properties.
引用
收藏
页码：4775 / 4784
页数：10
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