Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility

被引:6
|
作者
Wei, Qinghua [1 ]
Cao, Bin [1 ,2 ]
Yuan, Hao [1 ]
Chen, Youyang [1 ]
You, Kangdong [1 ]
Yu, Shuting [1 ]
Yang, Tixin [1 ]
Dong, Ziqiang [1 ]
Zhang, Tong-Yi [1 ,2 ,3 ]
机构
[1] Shanghai Univ, Mat Genome Inst, Shanghai 200444, Peoples R China
[2] Hong Kong Univ Sci & Technol Guangzhou, Adv Mat Thrust, Guangzhou 511400, Guangdong, Peoples R China
[3] Guangzhou Municipal Key Lab Mat Informat, Guangzhou 511400, Guangdong, Peoples R China
关键词
SN; BI; PROPERTY; MICROSTRUCTURE; OPTIMIZATION; DISCOVERY; ADDITIONS; GROWTH; ZN;
D O I
10.1038/s41524-023-01150-0
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The attainment of both high strength and high ductility is always the goal for structure materials, because the two properties generally are mutually competing, called strength-ductility trade-off. Nowadays, the data-driven paradigm combined with expert domain knowledge provides the state-of-the-art methodology to design and discovery for structure materials with high strength and high ductility. To enhance both strength and ductility, a joint feature is proposed here to be the product of strength multiplying ductility. The strategy of "divide and conquer" is developed to solve the contradictory problem, that material experimental data of mechanical behaviors are, in general, small in size and big in noise, while the design space is huge, by a newly developed data preprocessing algorithm, named the Tree-Classifier for Gaussian Process Regression (TCGPR). The TCGPR effectively divides an original dataset in a huge design space into three appropriate sub-domains and then three Machine Learning (ML) models conquer the three sub-domains, achieving significantly improved prediction accuracy and generality. After that the Bayesian sampling is applied to design next experiments by balancing exploitation and exploration. Finally, the experiment results confirm the ML predictions, exhibiting novel lead-free solder alloys with high strength high ductility. Various material characterizations were also conducted to explore the mechanism of high strength and high ductility of the alloys.
引用
收藏
页数:10
相关论文
共 50 条
  • [21] Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys
    Wade, N
    Wu, KP
    Kunii, J
    Yamada, S
    Miyahara, K
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1228 - 1231
  • [22] High-temperature shear strength and hardness of cast lead-free solders
    Mahmudi, R.
    Maraghi, A.
    Geranmayeh, A. R.
    KOVOVE MATERIALY-METALLIC MATERIALS, 2017, 55 (03): : 211 - 216
  • [23] High temperature reliability of lead-free solder joints in a flip chip assembly
    Amalu, Emeka H.
    Ekere, Ndy N.
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2012, 212 (02) : 471 - 483
  • [24] Accelerated Design for High-Entropy Alloys Based on Machine Learning and Multiobjective Optimization
    Ma, Yingying
    Li, Minjie
    Mu, Yongkun
    Wang, Gang
    Lu, Wencong
    JOURNAL OF CHEMICAL INFORMATION AND MODELING, 2023, 63 (19) : 6029 - 6042
  • [25] Interrelation of wettability-microstructure-tensile strength of lead-free Sn-Ag and Sn-Bi solder alloys
    Osorio, Wislei R.
    Garcia, Amauri
    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2016, 21 (06) : 429 - 437
  • [26] Design of novel AlCoFeNiV high-entropy alloys with high-strength and high-ductility
    Wang, Xin
    An, Zibing
    Cai, Jixiang
    Jiang, Cheng
    Su, Honghong
    Luo, Xianmin
    Li, Ziyao
    Wu, Shichang
    Yang, Luyan
    Long, Haibo
    Zhang, Jianfei
    Mao, Shengcheng
    Zhang, Ze
    Han, Xiaodong
    MATERIALS CHARACTERIZATION, 2023, 203
  • [27] Optimizing a machine learning design of dielectric properties in lead-free piezoelectric ceramics
    Rocha, Helder R. O.
    Roukos, Roy
    Abou Dargham, Sara
    Romanos, Jimmy
    Chaumont, Denis
    Silva, Jair A. L.
    Wortche, Heinrich
    MATERIALS & DESIGN, 2024, 243
  • [28] Intelligent Design of High Strength and High Conductivity Copper Alloys Using Machine Learning Assisted by Genetic Algorithm
    Khandelwal, Parth
    Harshit
    Manna, Indranil
    CMC-COMPUTERS MATERIALS & CONTINUA, 2024, 79 (01): : 1727 - 1755
  • [29] Microstructure and Fatigue Life of the Binary Lead-free Alloys with High Zn Content
    Pietrzak, K.
    Klasik, A.
    Maj, M.
    Sobczak, N.
    ARCHIVES OF FOUNDRY ENGINEERING, 2018, 18 (04) : 65 - 70
  • [30] High-Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead-Free Solder
    Mayer, Carl R.
    Lotfian, Saeid
    Molina-Aldareguia, Jon
    Chawla, Nikhilesh
    ADVANCED ENGINEERING MATERIALS, 2015, 17 (08) : 1168 - 1174