Ultrasonic Field Induces Better Crystallinity and Abundant Defects at Grain Boundaries to Develop CuS Electromagnetic Wave Absorber

被引:107
作者
Chen, Geng [1 ]
Liang, Hongsheng [1 ]
Yun, Jijun [1 ]
Zhang, Limin [1 ]
Wu, Hongjing [1 ]
Wang, Jianyuan [1 ]
机构
[1] Northwestern Polytech Univ, Sch Phys Sci & Technol, MOE Key Lab Mat Phys & Chem Extraordinary, Xian 710072, Peoples R China
基金
美国国家科学基金会;
关键词
crystallinity; CuS; defects; grain boundaries; ultrasonic field; COPPER SULFIDE; ABSORPTION; GROWTH; MXENE;
D O I
10.1002/adma.202305586
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Ultrasonic field (USF) is widely used to regulate the intrinsic properties of materials that are not applied in electromagnetic wave (EMW) absorption. One reason is that the lack of a response mechanism for the materials to USF hinders the expansion of their EMW absorption performance. Therefore, to address this issue, a series of CuS nanoparticles with diverse anions are constructed in the presence or absence of USF. The ultrasonic-induced cavitation effect can significantly promote CuS crystallization and lead to the accumulation of S defects at the grain boundaries (GBs). Furthermore, the S defects at the GBs are easily oriented and arranged, allowing the polarization relaxation retention to be maintained at 10 wt%. Consequently, the CuS with a nitrate precursor under USF shows an optimum effective absorption bandwidth (EAB) of 10.24 GHz at a thickness of 3.5 mm, which is 228.6% more than that without the USF. CuS with a chloride precursor also achieves an EAB of 3.92 GHz, even at a considerably low filler ratio. Thus, this study demonstrates the response mechanism of diverse anions to the USF for the first time and provides a novel technique to optimize the EMW absorption performance of semiconductors. The ultrasonic induced-cavitation effect can significantly promote CuS crystallization and lead to the accumulation of S defects at grain boundaries. As a result, the CuS with nitrate precursor under USF (UNCu) shows the optimum effective absorption bandwidth of 10.24 GHz at a thickness of 3.5 mm, which is 228.6% more than the WUNCu (absence of USF).image
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页数:11
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