Micro-Transfer Printing for Heterogeneous Si Photonic Integrated Circuits

被引：40

作者：

Roelkens, Gunther ^{[1
]}

Zhang, Jing ^{[1
]}

Bogaert, Laurens ^{[1
]}

Billet, Maximilien ^{[1
]}

Wang, Dongbo ^{[1
]}

Pan, Biwei ^{[1
]}

Kruckel, Clemens J. ^{[1
]}

Soltanian, Emadreza ^{[1
]}

Maes, Dennis ^{[1
]}

Vanackere, Tom ^{[1
]}

Vandekerckhove, Tom ^{[1
]}

Cuyvers, Stijn ^{[1
]}

De Witte, Jasper ^{[1
]}

Lufungula, Isaac Luntadila ^{[1
]}

Guo, Xin ^{[1
]}

Li, He ^{[1
]}

Qin, Senbiao ^{[1
]}

Muliuk, Grigorij ^{[5
]}

Uvin, Sarah ^{[1
,2
]}

Haq, Bahawal ^{[1
,3
]}

op de Beeck, Camiel ^{[1
,4
]}

Goyvaerts, Jeroen ^{[1
,4
]}

Lepage, Guy ^{[5
]}

Verheyen, Peter ^{[5
]}

Van Campenhout, Joris ^{[5
]}

Morthier, Geert ^{[1
]}

Kuyken, Bart ^{[1
]}

Van Thourhout, Dries ^{[1
]}

Baets, Roel ^{[1
]}

机构：

[1] Ghent Univ Imec, Dept Informat Technol, Photon Res Grp, B-9052 Ghent, Belgium

[2] Brolis Sensor Technol, B-9052 Ghent, Belgium

[3] Global Foundries, D-01109 Dresden, Germany

[4] LIGENTEC, EPFL Innovat Pk Batiment L, CH-1024 Ecublens, Switzerland

[5] Imec, B-3001 Heverlee, Belgium

来源：

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 2023年 / 29卷 / 03期

基金：

欧洲研究理事会; 欧盟地平线“2020”;

关键词：

Silicon; Photonics; Printing; Optical waveguides; Integrated optics; Substrates; III-V semiconductor materials; Integrated optoelectronics; photodiodes; printing; semiconductor lasers; silicon on insulator technology; wafer-scale integration; waveguide components; SILICON; PHOTODIODES; EFFICIENT;

D O I：

10.1109/JSTQE.2022.3222686

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Silicon photonics (SiPh) is a disruptive technology in the field of integrated photonics and has experienced rapid development over the past two decades. Various high-performance Si and Ge/Si-based components have been developed on this platform that allow for complex photonic integrated circuits (PICs) with small footprint. These PICs have found use in a wide range of applications. Nevertheless, some non-native functions are still desired, despite the versatility of Si, to improve the overall performance of Si PICs and at the same time cut the cost of the eventual Si photonic system-on-chip. Heterogeneous integration is verified as an effective solution to address this issue, e.g. through die-wafer-bonding and flip-chip. In this paper, we discuss another technology, micro-transfer printing, for the integration of non-native material films/opto-electronic components on SiPh-based platforms. This technology allows for efficient use of non-native materials and enables the (co-)integration of a wide range of materials/devices on wafer scale in a massively parallel way. In this paper we review some of the recent developments in the integration of non-native optical functions on Si photonic platforms using micro-transfer printing.

引用

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