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2D Material-Based MVS Model and Circuit Performance Analysis for GeH Field-Effect Transistors
被引:0
作者:
Zhao, Yiju
[1
]
Yoon, Youngki
[1
]
Wei, Lan
[1
]
机构:
[1] Univ Waterloo, Waterloo Inst Nanotechnol, Dept Elect & Comp Engn, Waterloo, ON N2L 3G1, Canada
基金:
加拿大自然科学与工程研究理事会;
关键词:
Integrated circuit modeling;
Semiconductor device modeling;
Quantum capacitance;
Mathematical models;
MOSFET;
Capacitance;
Performance evaluation;
2D materials;
MOSFETs;
quantum transport simulation;
NEGF;
compact model;
and circuit simulation;
QUANTUM CAPACITANCE;
LIMIT;
D O I:
10.1109/TNANO.2023.3330165
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
This paper presents an improved multi-level simulation framework for 2D material-based nanoelectronics, which expands from device simulation, physics-based compact modeling, and circuit benchmarking, using the germanane (GeH) metal-oxide-semiconductor field-effect transistors (MOSFETs) as an example. The device simulation employs the non-equilibrium Green's function method to obtain the characteristics of 2D GeH MOSFETs for both n-type MOSFETs and p-type MOSFETs. A compact model based on the MIT virtual source model is then revised to capture the unique behaviors of 2D-material-based MOSFETs, including voltage dependency of virtual source velocity and drain-induced barrier lowering, as well as the effect of quantum capacitance. HSPICE circuit simulations are performed to analyze and optimize CMOS digital benchmark circuits. The case study demonstrates that 2D material-based transistors favor a different range of supply voltage and threshold voltage than their silicon counterpart, to achieve the optimal energy-delay product. The impact of contact resistance is also analyzed using the proposed framework. This study offers a seamless multi-level simulation approach to bridge the gap between nanoelectronics and circuit behavior, thereby advancing the understanding of materials, devices, and circuits comprehensively. The framework tailored for GeH MOSFETs provides accurate device-circuit co-optimization which can be easily extended to devices based on other 2D materials.
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页码:792 / 799
页数:8
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