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Solid solution softening at room temperature and hardening at elevated temperatures: a case by minor Mn addition in a (HfNbTi)85Mo15 refractory high entropy alloy
被引:1
|作者:
Li, Xiaolong
[1
]
Ding, Mao
[2
]
Hu, Qiang
[3
]
Liu, Zhiyuan
[2
]
Mao, Huahai
[4
]
Guo, Sheng
[1
]
机构:
[1] Chalmers Univ Technol, Dept Ind & Mat Sci, SE-41296 Gothenburg, Sweden
[2] Shenzhen Univ, Coll Mechatron & Control Engn, Shenzhen 518060, Peoples R China
[3] Jiangxi Acad Sci, Inst Appl Phys, Nanchang 330096, Peoples R China
[4] Thermo Calc Software AB, Rasundavagen 18A, SE-16967 Stockholm, Sweden
基金:
瑞典研究理事会;
关键词:
refractory high entropy alloys;
solid solution softening and hardening;
solid solutions;
DILUTE;
D O I:
10.1088/2053-1591/ad068c
中图分类号:
T [工业技术];
学科分类号:
08 ;
摘要:
To address the conflict between room-temperature (RT) ductility and high-temperature (HT) strength in single phase bcc-structured refractory high entropy alloys, here we propose to use minor alloying to achieve solid solution softening at RT and simultaneously, solid solution hardening at HT. Our strategy was manifested by minor Mn additions in a RT brittle (HfNbTi)(85)Mo-15 refractory high entropy alloy, where nominal Mn additions ranging from 2 at. % down to 0.03 at. % were seen to soften the base (HfNbTi)(85)Mo-15 alloy at RT, while to harden the base alloy at the temperature range from 400 to 800 degrees C. The yield stress in all studied alloys showed a three-stage pattern, characterized by a temperature dependent stage at temperatures below 400 degrees C, followed by a temperature independent stage at intermediate temperatures ranging from 400 to 800 degrees C, and finally another temperature dependent stage at temperatures higher than 800 degrees C. The mechanisms for solid solution softening and solid solution hardening in single phase bcc-structured refractory high entropy alloys were discussed, together with their temperature dependence.
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