共 50 条
- [31] Research on the Reliability of Interconnected Solder Joints of Copper Pillars under Random Vibration Journal of Electronic Testing, 2024, 40 : 107 - 116
- [32] Reliability assessment method of drainage lines under electrical environmental coupling Dianli Xitong Baohu yu Kongzhi/Power System Protection and Control, 2022, 50 (10): : 84 - 93
- [33] Development of a dynamic test board for FCBGA solder joint reliability assessment in shock & vibration PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 256 - 262
- [35] Reliability Assessment of Solder Joints in Electronic Devices Under Extreme Thermal Fluctuations IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (08): : 1394 - 1400
- [37] Research on the evolution law and control mechanism of residual stress under vibration stress relief MATERIALS TODAY COMMUNICATIONS, 2024, 40
- [38] New test design method with small samples for reliability assessment of initiating explosive devices Hanneng Cailiao, 2007, 6 (608-611):
- [39] Environmental stress screening for electronic equipment by random vibration: a critical approach to reliability estimation and planning 2007 IEEE INSTRUMENTATION & MEASUREMENT TECHNOLOGY CONFERENCE, VOLS 1-5, 2007, : 768 - +
- [40] Review of Board-level Solder Joint Reliability under Environmental Stress 2016 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-CHENGDU), 2016,