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Effect of the electric field orientation on the thermal resistance of the solid-liquid interface
被引:2
|作者:
Liu, XueLing
[1
]
Hao, Jia
[1
]
Wang, JianSheng
[1
]
机构:
[1] Tianjin Univ, Sch Mech Engn, Tianjin, Peoples R China
关键词:
Molecular dynamics simulation;
applied electric field;
interfacial thermal resistance;
liquid/solid interface;
MOLECULAR-DYNAMICS SIMULATIONS;
HEAT-TRANSFER;
KAPITZA RESISTANCE;
WATER;
CONDUCTANCE;
TEMPERATURE;
NANOSCALE;
FLOW;
CONDUCTIVITY;
TRANSPORT;
D O I:
10.1080/08927022.2024.2324955
中图分类号:
O64 [物理化学(理论化学)、化学物理学];
学科分类号:
070304 ;
081704 ;
摘要:
With the rapid development of nanotechnology, using the applied electric field to regulate interfacial heat transfer has become increasingly important. In the present work, the relationship between the thermal resistance of Kapitza and the direction of the applied electric field is explored with nonequilibrium molecular dynamics method at a solid-liquid interface consisting of CU (0, 0, 1) and liquid water. It found that the electric field orientation induces the ordering of water molecules near the solid, which affects the magnitude of the Kapitza thermal resistance. In addition, the electric field orientation affects the degree of mismatch between solid and liquid vibrational dynamical density (VDOS), which affects the phonon transport at the solid-liquid interface, and ultimately affects the process of interfacial heat transfer. Furthermore, it's found that there is a weak correlation between the interfacial thermal resistance and the dimension of the copper-water model.
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页码:506 / 516
页数:11
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