Electrical Resistivity of Lead-Free Solders Reinforced by Carbon Nanospheres

被引：5
作者：
Plevachuk, Yu. [1 ,2 ]
Poverzhuk, V. [2 ]
Svec Sr, P. [1 ]
Svec, P. [1 ]
Janotova, I. [1 ]
Janickovic, D. [1 ]
Rud, A. [3 ]
机构：
[1] Slovak Acad Sci, Inst Phys, Bratislava 84511, Slovakia
[2] Ivan Franko Natl Univ Lviv, Dept Met Phys, UA-79005 Lvov, Ukraine
[3] NAS Ukraine, GV Kurdyumov Inst Met Phys, UA-03142 Kiev, Ukraine
来源：
INTERNATIONAL JOURNAL OF THERMOPHYSICS | 2024年 / 45卷 / 03期
关键词：
Carbon nanospheres; Electrical resistivity; Lead-free solder; Melting-solidification; SN-AG-CU; INTERFACIAL INTERMETALLIC GROWTH; FREE COMPOSITE SOLDER; MECHANICAL-PROPERTIES; SHEAR-STRENGTH; MICROSTRUCTURE; NANOTUBES; ALLOYS; NANOPARTICLES; JOINTS;
D O I：
10.1007/s10765-023-03326-8
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Electrical resistivity of the nanocomposites Sn96.5Ag3Cu0.5 and Sn95,5Ag3,8Cu0,7 lead-free solder alloys with minor admixtures of carbon nanospheres (0.05 wt%) was measured in a wide temperature range, including a melting-solidification region. Influence of the carbon nanospheres content on electrical resistivity values has been analyzed. Carbon nanospheres were obtained by electrical discharge method from diesel fuel, cyclohexane, and aviation kerosene. The matrix samples were produced by planar flow casting technique in the form of thin ribbons. Electrical resistivity measurements were performed using four-probe method. Hysteresis between the heating and cooling electrical resistivity curves relates to the non-equilibrium solidification.
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页数：14
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