Emerging electrochemical additive manufacturing technology for advanced materials: Structures and applications

被引:13
作者
Siddiqui, Hafsa [1 ]
Singh, Netrapal [1 ,2 ]
Naidu, Palash [3 ]
Rao, Koyalada Bhavani Srinivas [1 ]
Gupta, Shaily [4 ]
Srivastava, Avanish Kumar [1 ,2 ]
Santosh, M. S. [5 ,9 ]
Natarajan, Sathish [1 ,2 ]
Kumar, Surender [1 ,2 ]
Dumee, Ludovic F. [6 ,7 ]
Rtimi, Sami [8 ]
机构
[1] CSIR Adv Mat & Proc Res Inst AMPRI, Bhopal 462026, India
[2] Acad Scienti fi c & Innovat Res AcSIR, Ghaziabad 201002, India
[3] Rani Durgavati Univ, Jabalpur 482001, India
[4] Vellore Inst Technol, Vellore 632014, India
[5] Cent Inst Min & Fuel Res CIMFR, Coal Hydrogen Energy Sustainable Solut CHESS Div, CSIR, Digwadih Campus PO FIR, Dhanbad 828108, India
[6] Khalifa Univ, Dept Chem Engn, Abu Dhabi, U Arab Emirates
[7] Khalifa Univ, Res & Innovat Ctr CO2 & Hydrogen RICH, Sas Al Nakhl Campus, Abu Dhabi, U Arab Emirates
[8] Global Inst Water Environm & Hlth, CH-1210 Geneva, Switzerland
[9] CSIR, Cent Inst Min & Fuel Res CIMFR, Coal & Mineral Proc Div, Digwadih Campus,PO FRI, Dhanbad 828108, India
关键词
Electrochemical additive manufacturing; Masks less-ECAM procedures; Parameters; Materials; Industrial applications; COPPER COLUMNS; DEPOSITION; ELECTRODEPOSITION; FABRICATION; LIQUID; MICROFABRICATION; NANOPIPETTE; BEHAVIOR; DEVICES; METALS;
D O I
10.1016/j.mattod.2023.10.008
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electrochemical additive manufacturing (ECAM) has emerged as a promising cluster of technologies with the potential to fabricate complex 3D micro/nanostructures within a diverse range of materials, serving a broad spectrum of applications. However, significant obstacles must be overcome in order to realize its full potential and produce durable materials capable of competing with present cutting-edge offers. For this, the current review provides an extensive overview of the state-of-the-art ECAM technologies including localized electrochemical deposition (LED), meniscus-confined electrodeposi-tion (MCED), electrohydrodynamic redox printing (EHD-RP), fluid FM electrodeposition, and scanning ion conductance microscopy (SICM) and emphasizes esoteric developments in these technologies. Here, we deeply explore recent advances in printability of diverse material, structure-property correlations, dimensionality control, theoretical investigations, and modeling initiatives followed by the outline of difficulties and trends influencing the emerging research. This review, directs its focus toward the emerging scenarios of ECAM technologies, shedding light on their unique operational mechanisms and their potential utilization across numerous engineering domains, including micro-electronics (chips and circuits), energy storage (batteries and supercapacitors) sensing (electrochemical and SERS sensor), decorative art (warli art, spiritual, and abstract designs), electromagnetic shielding, catalysis and separation, to bridge the existing gaps between material properties and applications precisely. Inconclusive remarks, we discussed our perspective with unique ideas that can be used to collectively focus on this field to achieve freeform production of various materials for commercialization.
引用
收藏
页码:161 / 192
页数:32
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