Towards development of sustainable lightweight 3D printed wall building envelopes-Experimental and numerical studies

被引:24
作者
Cuevas, Karla [1 ]
Strzalkowski, Jaroslaw [2 ]
Kim, Ji-Su
Ehm, Clemens [1 ]
Glotz, Theresa [3 ]
Chougan, Mehdi [4 ]
Ghaffar, Seyed Hamidreza [4 ,5 ,6 ]
Stephan, Dietmar [1 ]
Sikora, Pawel [1 ,2 ]
机构
[1] Tech Univ Berlin, Bldg Mat & Construction Chem, Gustav Meyer Allee 25, D-13355 Berlin, Germany
[2] West Pomeranian Univ Technol Szczecin, Fac Civil & Environm Engn, Szczecin, Poland
[3] Univ Seoul, Dept Civil Engn, Seoul, South Korea
[4] Tech Univ Berlin, Struct Mech, Berlin, Germany
[5] Brunel Univ London, Dept Civil & Environm Engn, London UB8 3PH, England
[6] Appl Sci Private Univ, Appl Sci Res Ctr, Amman, Jordan
关键词
3D printing; Lightweight concrete; Wall; Thermal insulation; Building envelope; THERMAL-PROPERTIES; CONCRETE; CONSTRUCTION;
D O I
10.1016/j.cscm.2023.e01945
中图分类号
TU [建筑科学];
学科分类号
0813 ;
摘要
3D printing technology can be of crucial importance in the design of sustainable and energy -efficient building envelopes. With this technology, there is the potential to mechanically and thermally optimise the topology of printed walls. Additionally, the printing and infill materials used can be insulating, and thus contributing to the overall reduction of heat loss. To date, limited examples of 3D printed envelopes and information about the thermal and mechanical perfor-mance of 3D printed walls are available. This study developed a 3D printable wall element with an insulating property for application in building envelopes. Seven wall topologies are studied through simulations of mechanical and thermal performance using two mixtures: a control mixture (normal-weight) and a lightweight mixture containing expanded thermoplastic micro -spheres (ETM) for thermal insulation. One wall topology is selected based on the performance of the simulation and printed using both mixtures. The 3D printed envelopes were tested under compressive strength and analysed with the ARAMIS system, a digital image correlation (DIC) technology. Computer simulations and the DIC analysis identified the main causes for failure, which are the inter-filament weakness and the imperfections of the geometry of the printed envelope.
引用
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页数:18
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