Vacuum Thermoforming for Packaging Flexible Electronics and Sensors in E-Textiles

被引：2

作者：

Valavan, Ashwini ^{[1
]}

Komolafe, Abiodun ^{[1
]}

Harris, Nick R. ^{[1
]}

Beeby, Steve ^{[1
]}

机构：

[1] Univ Southampton, Sch Elect & Comp Sci, Southampton SO17 1BJ, England

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2023年 / 13卷 / 05期

基金：

英国工程与自然科学研究理事会;

关键词：

Packaging; thermoplastic films; vacuum forming;

D O I：

10.1109/TCPMT.2023.3283015

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Packaging of flexible electronics is essential for e-textile applications to reduce degradation of performance caused by mechanical stress and environmental effects and to increase durability. Conformal coatings for packaging have the advantage of reducing rigidity and can be seamlessly integrated into fabrics. Vacuum forming is a technique for packaging electronic devices with thermoplastic films of various thicknesses providing uniform coating. Polyurethane is a widely used thermoplastic material in e-textile and can be easily processed by vacuum forming for packaging. In this article, a detailed explanation of the working of Formech 450DT vacuum former is discussed for packaging small electronic chip for e-textile application with thermoplastic polyurethane (TPU). Two types of flexible circuits were packaged: a carbon monoxide (CO) gas sensor and a series of resistors on flexible PCB. The packaged CO flexible sensor and series resistors endured 5.3 times and 1.7 times, respectively, more bending cycles than unpackaged flexible electronic filament samples. For the washing cycles, the packaged flexible strips with CO sensor and series resistors endured 1.5 times.

引用

页码：715 / 723

页数：9