The Co-Design of Broadband Diplexer and Quasi-Reflectionless Lowpass/Highpass TFIPD Filter Chip

被引：8

作者：

Kong, Mengdan ^{[1
]}

Wu, Yongle ^{[1
]}

Wang, Weimin ^{[1
]}

机构：

[1] Beijing Univ Posts & Telecommun, Sch Elect Engn, Beijing Key Lab Work Safety Intelligent Monitoring, Beijing 100876, Peoples R China

来源：

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | 2023年 / 70卷 / 02期

基金：

北京市自然科学基金;

关键词：

Resonator filters; 5G mobile communication; Scattering parameters; Resistors; Reflection coefficient; Reflection; Radio frequency; Diplexer; lowpass; Index Terms; highpass filter; N78 and N79; quasi-reflectionless; thin film integrated passive devices (TFIPD);

D O I：

10.1109/TCSII.2022.3211974

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new ultra-miniaturized 5G N78 and N79 diplexer based on GaAs Thin Film Integrated Passive Device (TFIPD) technology is proposed in this brief. By a NiCr thin film resistor, the quasi-reflectionless lowpass/highpass filter can also be achieved on the same circuit structure without any increase of size. Circuit schematic is composed of serial-parallel inductances and capacitances, which generates out-of-band transmission zeros. The proposed design provides <2 dB insertion loss and >15 dB out-of-band rejection. Therefore, the GaAs-based TFIPD technology can support low-loss, high-precision, and miniaturized design desires of 5G radio-frequency (RF) front-end devices. Chip model is demonstrated through EM simulation, wafer fabrication, and measurement.

引用

页码：486 / 490

页数：5

共 21 条

[1] Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates [J].

Ali, Muhammad ;

Watanabe, Atom ;

Kakutani, Takenori ;

Raj, Pulugurtha M. ;

Tummala, Rao R. ;

Swaminathan, Madhavan .

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, :1376-1382

[2] Planar Wideband High-Selectivity Impedance-Transforming Differential Bandpass Filter With Deep Common-Mode Suppression [J].

Chen, Weijuan ;

Wu, Yongle ;

Wang, Weimin .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2020, 67 (10) :1914-1918

[3] Bridged-T Coil for Miniature Dual-Band Branch-Line Coupler and Power Divider Designs [J].

Fang, Wei-Ting ;

Chang, En-Wei ;

Lin, Yo-Shen .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2018, 66 (02) :889-901

[4] A diplexer based on transmission lines, implemented in LTCC [J].

Fritz, Martin ;

Wiesbeck, Werner .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (03) :427-432

[5] Embedded 3D-IPD Technology based on Conformal 3D-RDL: Application for Design and Fabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun [J].

Ghannam, Ayad ;

Magnani, Alessandro ;

Bourrier, David ;

Parra, Thierry .

2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, :1867-1874

[6] High-Order Input-Reflectionless Bandpass/Bandstop Filters and Multiplexers [J].

Gomez-Garcia, Roberto ;

Munoz-Ferreras, Jose-Maria ;

Psychogiou, Dimitra .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2019, 67 (09) :3683-3695

[7]

Hong J. S., 2004, Microstrip Filter for RF/Microwave Applications

[8] Four-Port Symmetrical Reflectionless Lumped Filter/Diplexer: Prototype and Design Table [J].

Jin, Xiu-Hua ;

Huang, Xiao-Dong ;

Ren, Qiang ;

Cheng, Chong-Hu .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2021, 69 (04) :2211-2219

[9] Embedded RF Passives Technology Using a Combination of Multilayer Organic Package Substrate and Silicon-Based Integrated Passive Devices [J].

Kamgaing, Telesphor ;

Vilhauer, Reed ;

Nair, Vijay ;

Choudhury, Debabani .

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, :1547-1551

[10] Ultra-Miniaturized Wideband Input-Absorptive Bandstop Filter Based on TFIPD Technology [J].

Kong, Mengdan ;

Wu, Yongle ;

Zhuang, Zheng ;

Wang, Weimin ;

Wang, Cong .

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2021, 68 (07) :2414-2418

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