High performance epoxy cresol novolac photocuring resins: Tailoring performance through adamantane modification

With the development of high-frequency communication technology, higher heat resistance and lower dielectric constant requirements have been put forward on solder resins. The introduction of rigid groups is expected to meet these requirements. Adamantane has an alicyclic hydrocarbon with a large spatial structure, which can be introduced into solder resist resins to improve their overall performance. In this paper, 3-amino-1-adamantanol (AD) was introduced into the epoxy cresol novolac (EOCN). Firstly, amino reacted with epoxy groups, followed by the reaction of anhydride with hydroxyl groups. The carboxyl groups introduced after the anhydride reaction can further react with glycidyl methacrylate (GMA). Finally, a new type of photocuring resin was obtained by adjusting the type of anhydride. Intriguingly, when the anhydride is maleic anhydride (MA), the higher crosslinking density and the tuning of the flexible molecular chain densification during the curing process allow the resin to possess high T-g and high storage modulus properties. As a consequence, the optimized UV -curable film has a strong storage modulus (2615.84 MPa), excellent heat resistance (T-g: 181.57degree celsius), and low dielectric constant (2.7 at 1 Hz). It also provides an effective strategy for the design and fabrication of high -performance EOCN-based photocuring materials.