Fatigue crack growth behavior of Al 2014 alloy subjected to cryogenic rolling and post-rolled annealing

被引：1
作者：
Joshi, Amit [1 ]
Yogesha, K. K. [2 ]
Chamoli, Sunil [1 ]
Jayaganthan, Rengaswamy [3 ]
Owolabi, Gbadebo Moses [4 ]
机构：
[1] Natl Inst Engn, GB Pant Inst Engn & Technol Pauri Garhwal, Dept Mech Engn, Mysuru 570008, India
[2] Indian Inst Technol Madras, Dept Mech Engn, Chennai 600036, India
[3] Indian Inst Technol Madras, Dept Engn Design, Chennai 600036, India
[4] Howard Univ, Dept Mech Engn, Washington, DC USA
来源：
KOVOVE MATERIALY-METALLIC MATERIALS | 2023年 / 61卷 / 05期
关键词：
Al alloys; cryorolling; annealing; fatigue crack growth rate; fractography; SEVERE PLASTIC-DEFORMATION; MECHANICAL-PROPERTIES; ULTRA-FINE; GRAIN-SIZE; TEMPERATURE; METALS; PRECIPITATION; STABILITY; EVOLUTION; LIFE;
D O I：
10.31577/km.2023.5.285
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The present study investigated grain growth, recrystallization, and fatigue crack growth behavior of Al-Cu-Si alloy subjected to cryorolling and annealing treatment for 1 h. Temperature from 373 to 523 K was considered for this study. Cryorolling is used to produce ultra-fine-grained (UFG) structures, while annealing is used to study the recrystallization and grain growth. The fatigue crack growth (FCG) rate was measured in the low-stress intensity factor range (& UDelta;K) (Stage II) and high-stress intensity factor ranges using the Paris equation and measuring the striation width. The results discovered that cryorolling led to a significant decrease in the fatigue crack growth resistance in the low-stress intensity factor range compared to coarse grain counterparts due to a decrease in the crack closure level in the cryorolled alloy. The results also showed that the fatigue crack growth resistance of the cryorolled alloy improved in the high-stress intensity factor range due to the formation of ultra-fine-grained microstructure, resulting in fine striations observed from the fractographic studies. The post-annealed samples at 373 K exhibited higher fatigue crack growth resistance in low and high-stress intensity factor ranges. High fatigue crack growth resistance in the annealed sample in low and high-stress intensity factor range is attributed to the fine semicoherent spherical phase & theta;'.
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页码：285 / 305
页数：21
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