Improving the reliability of power modules through layered diffusion solder interconnects - Comparative study based on experiments and FE-simulation

被引：1

作者：

Ottinger, B. ^{[1
,3
]}

Mathew, A. ^{[2
]}

Koenig, S. ^{[1
]}

Albrecht, J. ^{[2
]}

Sprenger, M. ^{[1
,2
,3
]}

Mueller, L. ^{[1
]}

Goth, C. ^{[1
]}

Franke, J. ^{[3
]}

机构：

[1] Vitesco Technol Germany GmbH, Nurnberg, Germany

[2] Fraunhofer ENAS, Chemnitz, Germany

[3] Friedrich Alexander Univ Erlangen Nurnberg, Inst Factory Automat & Prod Syst, Nurnberg, Germany

来源：

MICROELECTRONICS RELIABILITY | 2023年 / 150卷

关键词：

Solder joint; Diffusion soldering; TLPS; Reliability test; FE; -simulation; Lifetime estimation; JOINTS;

D O I：

10.1016/j.microrel.2023.115097

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The demand for reliable, lead-free and high temperature stable solder interconnects for power electronic application has increased in recent years. The die attach solder materials are exposed to higher electrical currents and temperatures due to advancing designs and wide band-gap semiconductors. The diffusion soldering material Sn-Cu-Sn with its high post processing melting temperature is a promising option for high temperature die attach interconnects. The aim of this work is to predict potential failure mechanisms in the die attach of automotive power modules due to simulation based thermo-mechanical analysis of the diffusion solder Sn-Cu-Sn layer and SAC. The FE-model is validated with experimental results from active power cycling tests. The simulation indicates a potential for lifetime increase by usage of layered diffusion solder. The created FE-simulation model could be used for simulation-based design for reliability to reduce material costs and development time.

引用

页数：6

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