Metamaterial and SIW inspired isolating fences for lateral de-coupling in MIMO antenna

被引:5
作者
Anand, S. [1 ]
Theetharappan, R. [1 ]
机构
[1] Mepco Schlenk Engn Coll Autonomous, Dept Elect & Commun Engn, Sivakasi, India
关键词
MIMO; DGS; Metamaterials; HMSIW; Isolating Fence (IF); Decoupling; ECC; DG; MEG; Channel capacity; ENHANCEMENT;
D O I
10.1016/j.aeue.2023.154667
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper proposes seven isolating fences (IF) for MIMO using novel rotated complementary split ring resonators (RCSRR) and half-mode substrate integrated waveguides (HMSIW) for decoupling. The removing mutual coupling, especially in the lateral direction that is mainly due to surface and space waves is challenging in MIMO. The proposed method involves the RCSRR, HMSIW, and defected ground structure (DGS) to reduce the lateral mutual coupling. In terms of S parameters, radiation pattern, envelope correlation coefficient (ECC), diversity gain (DG), channel capacity, mean effective gain (MEG), and efficiency the performance of the MIMO antenna is examined. The proposed MIMO has the size of 35 x 48 x 1.6 mm3 is made of FR4 substrate material with a centre frequency of 10 GHz, a bandwidth (BW) of 12 GHz, and a gain in the range of 3.7-4.3 dBi.
引用
收藏
页数:13
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共 35 条
  • [1] Mutual Coupling Reduction of a Circularly Polarized MIMO Antenna Using Parasitic Elements and DGS for V2X Communications
    Abu Sufian, Md
    Hussain, Niamat
    Abbas, Anees
    Lee, Jaemin
    Park, Seong Gyoon
    Kim, Nam
    [J]. IEEE ACCESS, 2022, 10 : 56388 - 56400
  • [2] Isolation Enhancement of a Metasurface-Based MIMO Antenna Using Slots and Shorting Pins
    Abu Sufian, Md
    Hussain, Niamat
    Askari, Hussain
    Park, Seong Gyoon
    Shin, Kook Sun
    Kim, Nam
    [J]. IEEE ACCESS, 2021, 9 : 73533 - 73543
  • [3] High-isolation antenna array using SIW and realized with a graphene layer for sub-terahertz wireless applications
    Alibakhshikenari, Mohammad
    Virdee, Bal S.
    Salekzamankhani, Shahram
    Aissa, Sonia
    See, Chan H.
    Soin, Navneet
    Fishlock, Sam J.
    Althuwayb, Ayman A.
    Abd-Alhameed, Raed
    Huynen, Isabelle
    McLaughlin, James A.
    Falcone, Francisco
    Limiti, Ernesto
    [J]. SCIENTIFIC REPORTS, 2021, 11 (01)
  • [4] Comprehensive Survey on "Various Decoupling Mechanisms With Focus on Metamaterial and Metasurface Principles Applicable to SAR and MIMO Antenna Systems''
    Alibakhshikenari, Mohammad
    Babaeian, Fatemeh
    Virdee, Bal S.
    Aissa, Sonia
    Azpilicueta, Leyre
    See, Chan Hwang
    Althuwayb, Ayman Abdulhadi
    Huynen, Isabelle
    Abd-Alhameed, Raed A.
    Falcone, Francisco
    Limiti, Ernesto
    [J]. IEEE ACCESS, 2020, 8 : 192965 - 193004
  • [5] A Review of Mutual Coupling in MIMO Systems
    Chen, Xiaoming
    Zhang, Shuai
    Li, Qinlong
    [J]. IEEE ACCESS, 2018, 6 : 24706 - 24719
  • [6] Mutual Coupling Reduction in Dielectric Resonator Antennas Using Metasurface Shield for 60-GHz MIMO Systems
    Dadgarpour, Abdolmehdi
    Zarghooni, Behnam
    Virdee, Bal S.
    Denidni, Tayeb A.
    Kishk, Ahmed A.
    [J]. IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2017, 16 : 477 - 480
  • [7] Isolation enhanced compact dual-band quad-element MIMO antenna with simple parasitic decoupling elements
    Das Ayinala, Kabir
    Sahu, Prasanna Kumar
    [J]. AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 2021, 142
  • [8] Isolation Improvement of MIMO Antenna Using Novel EBG and Hair-Pin Shaped DGS at 5G Millimeter Wave Band
    Dey, Soumik
    Dey, Sukomal
    Koul, Shiban K.
    [J]. IEEE ACCESS, 2021, 9 : 162820 - 162834
  • [9] Metamaterial inspired dielectric resonator MIMO antenna for isolation enhancement and linear to circular polarization of waves
    Dwivedi, Ajay Kumar
    Sharma, Anand
    Singh, Ashutosh Kumar
    Singh, Vivek
    [J]. MEASUREMENT, 2021, 182
  • [10] High isolation metamaterial-based dual-band MIMO antenna for 5G millimeter-wave applications
    Esmail, Bashar Ali
    Koziel, Slawomir
    [J]. AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 2023, 158