Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling

被引:1
作者
Persoons, Tim [1 ]
Codecasa, Lorenzo [2 ]
机构
[1] Trinity Coll Dublin, Dept Mech Mfg & Biomed Engn, Dublin, Ireland
[2] Politecn Milan, Elect Engn, Milan, Italy
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2023年 / 13卷 / 08期
关键词
Special issues and sections; Thermal management; Electronic equipment; Cooling; Modeling; Power system dynamics; Density measurement;
D O I
10.1109/TCPMT.2023.3308669
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:1085 / 1087
页数:3
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