Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling

被引：1

作者：

Persoons, Tim ^{[1
]}

Codecasa, Lorenzo ^{[2
]}

机构：

[1] Trinity Coll Dublin, Dept Mech Mfg & Biomed Engn, Dublin, Ireland

[2] Politecn Milan, Elect Engn, Milan, Italy

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2023年 / 13卷 / 08期

关键词：

Special issues and sections; Thermal management; Electronic equipment; Cooling; Modeling; Power system dynamics; Density measurement;

D O I：

10.1109/TCPMT.2023.3308669

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1085 / 1087

页数：3

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