Bioinspired construction of size adjustable hollow polydopamine microspheres for ultra-low dielectric polyimide composites

被引:7
作者
Zhao, Wanjing [1 ]
Tong, Yizhang [1 ]
Lu, Chonghao [1 ]
Huang, Qilong [1 ]
Cao, Xianwu [1 ]
Li, Robert K. Y. [3 ]
Wu, Wei [2 ]
机构
[1] South China Univ Technol, Sch Mech & Automot Engn, Guangdong Prov Key Lab Tech & Equipment Macromol A, Natl Engn Res Ctr Novel Equipment Polymer Proc,Key, Guangzhou 510640, Peoples R China
[2] Jihua Lab, Engn Ctr Superlubr, Foshan 528200, Peoples R China
[3] City Univ Hong Kong, Dept Mat Sci & Engn, Kowloon, Hong Kong, Peoples R China
基金
中国国家自然科学基金;
关键词
Polyimide; Hollow polydopamine microspheres; Low dielectric; Thermal stability; MECHANICAL-PROPERTIES; WATER-UPTAKE; CONSTANT; FILMS; NANOCOMPOSITES; SPHERES;
D O I
10.1016/j.apsusc.2023.158714
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Polydopamine (PDA) has been extensively investigated due to its excellent adhesion ability and versatile chemical potential for secondary reactions. However, the potential application of hollow polydopamine micro spheres (H-PDA) in the field of low-dielectric electronic packaging remains an unexplored area. Here, H-PDA microspheres with adjustable size were synthesized by a template-assisted approach, and the influence of size and content of H-PDA on the comprehensive performance of PI/H-PDA composites was explored in detail. The morphology observation revealed that the presence of H-PDA could be homogeneously dispersed in the PI matrix, and the PI/H-PDA composite containing 2 wt% H-PDA-800 achieved the lowest dielectric constant of 1.96 with a dielectric loss of 0.0123 at 1 MHz. It was attributed to the synergistic effects of nano-sized air bubbles from H-PDA and the dielectric confinement effect. Meanwhile, PI/H-PDA composites maintained high thermal stability (T5 > 517 C). In addition, the incorporation of H-PDA had a strengthening and toughening effect on PI composites, which can be explained by the sliding theory of macromolecular chains. This work offers a feasible strategy to obtain ultra-low dielectric constant of porous PI composites while maintaining good mechanical properties and thermal stability.
引用
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页数:11
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