共 37 条
[21]
Development of High Density Fan Out Wafer Level Package (HD FOWLP) With Multi-layer Fine Pitch RDL for Mobile Applications
[J].
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2016,
:1522-1529
[23]
Imprint-Through Mold Via (i-TMV) with Highly-Effective Electromagnetic Interference Shielding for RF devices
[J].
2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC),
2020,
[24]
Le TH, 2020, 2020 23RD INTERNATIONAL MICROWAVE AND RADAR CONFERENCE (MIKON 2020), P157, DOI [10.23919/MIKON48703.2020.9253926, 10.23919/mikon48703.2020.9253926]
[25]
3-D Thin Film Interposer Based on TGV (Through Glass Vias): An Alternative to Si-Interposer
[J].
2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2010,
:66-73
[26]
Tsai C.H., 2013, P 2013 IEEE INT ELEC, p25.1.1
[27]
Small Pitch, High Aspect Ratio Via- last TSV Module
[J].
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC),
2016,
:43-49
[28]
InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
[J].
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018),
2018,
:202-207
[30]
First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules
[J].
2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017),
2017,
:236-241