Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications

被引：2
|
作者：
Yin, Yuhang [1 ]
Xia, Chenhui [1 ]
Liu, Shuli [1 ]
Zhang, Zhimo [1 ]
Chen, Chen [2 ]
Wang, Gang [1 ]
Wang, Chenqian [1 ]
Wu, Yafei [3 ]
机构：
[1] China Elect Technol Grp Corp, Res Inst 58, Wuxi 214035, Peoples R China
[2] Southeast Univ, Sch Elect Sci & Engn, Wuxi 214111, Peoples R China
[3] Univ Elect Sci & Technol China UESTC, Sch Elect Sci & Engn, Chengdu 611731, Peoples R China
来源：
ELECTRONICS | 2024年 / 13卷 / 05期
关键词：
FOWLP; TMV interposer; AiP; ultrathin; 5G mm-wave; BROAD-BAND; DESIGN;
D O I：
10.3390/electronics13050839
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 lambda 0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP's parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications.
引用
收藏
页数：12
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