Experimental and theoretical study of 2-mercaptopyridine as an effective eco-friendly inhibitor for copper in aqueous NaCl

被引:18
作者
Zhou, Hongbo [1 ]
Chen, Yang [1 ]
Luo, Chao [1 ]
Song, Honggun [1 ]
Yan, Hong [1 ]
Lin, Lishibao [2 ]
Hu, Zhi [1 ]
机构
[1] Nanchang Univ, Sch Adv Mfg, Nanchang 330031, Peoples R China
[2] Shanghai Jiao Tong Univ, Shanghai Key Lab Adv High Temp Mat & Precis Formin, Shanghai 200240, Peoples R China
基金
中国国家自然科学基金;
关键词
Copper protection; 2-mercaptopyridine; Corrosion inhibitor; Molecular dynamics simulation; MOLECULAR-DYNAMICS SIMULATION; QUANTUM-CHEMICAL CALCULATIONS; CORROSION-INHIBITORS; MILD-STEEL; SULFURIC-ACID; RAMAN-SPECTROSCOPY; ORGANIC-COMPOUNDS; HCL SOLUTION; DERIVATIVES; ADSORPTION;
D O I
10.1016/j.molliq.2023.121924
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The high-efficiency and non-toxic inhibitors for copper and its alloys are of great importance for reducing the corrosion rate of copper in aggressive solutions. In this work, the inhibition effect of 2-mercaptopyridine (2-MP) for copper in NaCl aqueous solution was investigated by experiment and theoretical calculation. The comprehensive experimental results showed that the surface of the copper sample was still smooth after 72 h immersion in NaCl solution containing 0.75 g/L 2-MP inhibitor, and the inhibition efficiency could reach 93.27 %. Meanwhile, the Cu-N/S-Cu bonds were detected by X-ray photoelectron spectroscopy and Raman spectroscopy, indicating that the 2-MP inhibitor could adsorb on the copper surface directly. The adsorption of copper by 2-MP is compatible with the Langmuir isotherm adsorption. The difference in reactivity between 2-MP and 4-MP was analyzed by quantum chemistry calculation, while molecular dynamics (MD) simulation results showed that 2-MP has better inhibition performance than 4-MP. Furthermore, the compactness and hydrophobicity of the 2MP molecular layer were increased with a rise in 2-MP concentration, which effectively obstructed the diffusion of the water molecular and prevented the corrosive medium contact with the copper surface.
引用
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页数:15
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