A novel way to reduce the critical deformation for cold roll bonding

被引：5

作者：

Barienti, Khemais ^{[1
]}

Werwein, Stefan ^{[1
]}

Herbst, Sebastian ^{[1
]}

Maier, Hans Juergen ^{[1
]}

Nuernberger, Florian ^{[1
]}

机构：

[1] Leibniz Univ Hannover, Inst Werkstoffkunde Mat Sci, Univ 2, D-30823 Hannover, Germany

来源：

MANUFACTURING LETTERS | 2023年 / 36卷

关键词：

Cold roll bonding; Silane; Rolling; Copper; Aluminum; CORROSION; METALS; WATER;

D O I：

10.1016/j.mfglet.2022.12.006

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In the present study, a novel approach is presented to achieve oxygen partial pressures corresponding to extremely high vacuum (XHV) to foster cold roll bonding. Cold roll bonding of Al/Al and Cu/Cu as well as the heterogeneous combination Al/Cu were investigated with a focus on the minimum degree of defor-mation required to form a solid bond. By applying XHV-adequate conditions, the minimum degree of deformation for the formation of a solid bond could be reduced by up to 35%. Furthermore, it was evident that the adhesion behaviour changed during bond formation in XHV-adequate conditions.(c) 2023 Society of Manufacturing Engineers (SME). Published by Elsevier Ltd. All rights reserved.

引用

页码：9 / 12

页数：4

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