Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

被引:22
作者
Baruah, Ratul Kumar [1 ]
Yoo, Hocheon [2 ]
Lee, Eun Kwang [3 ]
机构
[1] Tezpur Univ, Dept Elect & Commun Engn, Tezpur 784028, Assam, India
[2] Gachon Univ, Dept Elect Engn, Seongnam 13120, South Korea
[3] Pukyong Natl Univ, Dept Chem Engn, Busan 48513, South Korea
基金
新加坡国家研究基金会;
关键词
metal routing; flexible devices; flexible metal; flexible textile; flexible circuits; plastic substrates; BATTERIES; PROGRESS; STRENGTH; SKIN; CHALLENGES; DEVICES; DESIGN; COPPER; ARRAY;
D O I
10.3390/mi14061131
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.
引用
收藏
页数:24
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