Stress analysis and optimization of pop package under random vibration loading

被引：0
作者：
Zhang, Tiantian [1 ]
Zhu, Ping [1 ]
Lian, Junjie [1 ]
Liu, Yunchun [1 ]
机构：
[1] North Univ China, Sch Instrumentat & Elect, Taiyuan, Peoples R China
来源：
IEICE ELECTRONICS EXPRESS | 2023年 / 20卷 / 22期
关键词：
POP; stress analysis; response surface method; parameter optimization; BGA;
D O I：
10.1587/elex.20.20230390
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The stress analysis of packaging on packaging (POP) under random vibration loading is conducted using the finite element model. The effect of structural parameters on solder joint stresses is analyzed by sensitivity analysis. Stress fitting is performed using the response surface method (RSM), and the optimization module is used to optimi-ze the structural parameters of POP packaging. The results demonstrate a reduction of 0.016 and 0.0031MPa in upper and lower solder joint stresses, respectively. This optimization of the structural parameters improves the reliability of the electronic packaging structure.
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页数：6
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