Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu-Cu Bonding

被引：8
|
作者：
Tseng, Hsiang-Hou [1 ,2 ]
Liu, Hung-Che [1 ,2 ]
Yu, Min-Hsun [1 ,2 ]
Ong, Jia-Juen [1 ,2 ]
Tran, Dinh-Phuc [1 ,2 ]
Chen, Chih [1 ,2 ]
机构：
[1] Natl Yang Ming Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan
[2] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan
来源：
CRYSTAL GROWTH & DESIGN | 2023年 / 23卷 / 08期
关键词：
GRAIN-BOUNDARY DIFFUSION; MICROPOROSITY;
D O I：
10.1021/acs.cgd.3c00157
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Copper joints have replaced solder interconnects in integrated circuits due to their great electrical properties and lower-temperature processing. To isolate Cu from oxidizing during bonding processes, a (111)-oriented nanotwinned Ag (NT-Ag) thin layer was electroless-deposited on a (111)-oriented NT-Cu film. Such a method outperforms the sputtering approach in terms of expenditure, environmental impact, and deposition rate. The microstructures of the Ag films were then analyzed. Results show that columnar NT-Ag grains epitaxially grew along the columnar NT-Cu grains. Additionally, two types of joints (Cu-Ag and Ag-Ag) were fabricated and characterized. We found that the bonding strength of the Cu-Ag joints was higher than that of the Ag-Ag joints. This could be attributed to the greater diffusion rate of Ag atoms in Cu than the self-diffusion of Ag.
引用
收藏
页码：5519 / 5527
页数：9
相关论文
共 50 条
  • [31] Mechanical properties of highly (111)-oriented nanotwinned Cu lines
    Lai, Wei-Ling
    Chen, Chih
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 220 - 222
  • [32] Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
    Liu, Tao-Chi
    Liu, Chien-Min
    Hsiao, Hsiang-Yao
    Lu, Jia-Ling
    Huang, Yi-Sa
    Chen, Chih
    CRYSTAL GROWTH & DESIGN, 2012, 12 (10) : 5012 - 5016
  • [33] Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films
    Lai, Yu-Chang
    Yang, Zi-Hong
    Chen, Yin-Hsuan
    Chen, Yen-Ting
    Lin, Ang-Ying
    Chuang, Tung-Han
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2024, 33 (16) : 8044 - 8056
  • [34] Cu-Cu Bonding by Ag Nanostructure at Low Temperature of 180 °C
    Liu, Ziyu
    Wang, Qian
    Cai, Jian
    Zou, Guisheng
    Liu, Lei
    Shen, Daozhi
    Tan, Lin
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
  • [35] Low Temperature Cu-Cu Bonding Using Ag Nanoparticles by PVD
    Wu, Zijian
    Wang, Qian
    Tan, Lin
    Liu, Ziyu
    Seo, Sun-Kyoung
    Cho, Tae-Je
    Cai, Jian
    2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,
  • [36] Low-Temperature Oxidation of Cu(100), Cu(110) and Cu(111)
    Kusano, Kensuke Fujita
    Uchikoshi, Masahito
    Mimura, Kouji
    Isshiki, Minoru
    OXIDATION OF METALS, 2014, 82 (3-4): : 181 - 193
  • [37] Low-Temperature Oxidation of Cu(100), Cu(110) and Cu(111)
    Kensuke Fujita Kusano
    Masahito Uchikoshi
    Kouji Mimura
    Minoru Isshiki
    Oxidation of Metals, 2014, 82 : 181 - 193
  • [38] Investigation of bonding mechanism for low-temperature Cu-Cu bonding with passivation layer
    Hong, Zhong-Jie
    Liu, Demin
    Hu, Han-Wen
    Cho, Chih-, I
    Weng, Ming-Wei
    Liu, Jui-Han
    Chen, Kuan-Neng
    APPLIED SURFACE SCIENCE, 2022, 592
  • [39] Low temperature and low pressure Cu-Cu bonding with Ag doped Cu nanosolder paste
    Li, Junjie
    Shi, Tielin
    Yu, Xing
    Cheng, Chaoliang
    Fan, Jinhu
    Liao, Guanglan
    Tang, Zirong
    2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM, 2016, : 127 - 129
  • [40] Epitaxial nanotwinned Cu films with high strength and high conductivity
    Anderoglu, O.
    Misra, A.
    Wang, H.
    Ronning, F.
    Hundley, M. F.
    Zhang, X.
    APPLIED PHYSICS LETTERS, 2008, 93 (08)
12345