Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu-Cu Bonding

被引：9

作者：

Tseng, Hsiang-Hou ^{[1
,2
]}

Liu, Hung-Che ^{[1
,2
]}

Yu, Min-Hsun ^{[1
,2
]}

Ong, Jia-Juen ^{[1
,2
]}

Tran, Dinh-Phuc ^{[1
,2
]}

Chen, Chih ^{[1
,2
]}

机构：

[1] Natl Yang Ming Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan

[2] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30010, Taiwan

来源：

CRYSTAL GROWTH & DESIGN | 2023年 / 23卷 / 08期

关键词：

GRAIN-BOUNDARY DIFFUSION; MICROPOROSITY;

D O I：

10.1021/acs.cgd.3c00157

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Copper joints have replaced solder interconnects in integrated circuits due to their great electrical properties and lower-temperature processing. To isolate Cu from oxidizing during bonding processes, a (111)-oriented nanotwinned Ag (NT-Ag) thin layer was electroless-deposited on a (111)-oriented NT-Cu film. Such a method outperforms the sputtering approach in terms of expenditure, environmental impact, and deposition rate. The microstructures of the Ag films were then analyzed. Results show that columnar NT-Ag grains epitaxially grew along the columnar NT-Cu grains. Additionally, two types of joints (Cu-Ag and Ag-Ag) were fabricated and characterized. We found that the bonding strength of the Cu-Ag joints was higher than that of the Ag-Ag joints. This could be attributed to the greater diffusion rate of Ag atoms in Cu than the self-diffusion of Ag.

引用

页码：5519 / 5527

页数：9

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