Facial synthesis of Cu@Ag core-shell particles through temperature gradient method with excellent oxidation resistance

To improve the oxidation resistance of Cu particles, the temperature gradient method is used to prepare Cu@Ag core-shell particles (TG-Cu@AgCSPs) with uniform particle size and enhanced oxidation resistance. The TG-Cu@AgCSPs are spherical, with an average size of 2.9 mu m, and the average thickness of the Ag shells is 280 nm. The morphological analysis and thermogravimetric results show that the TG-Cu@AgCSPs possess denser Ag shells and better oxidation resistance compared to core-shell particles prepared by the thermostatic method. The thermal oxidation behavior of TG-Cu@AgCSPs is investigated by heating in air. When heated below 300 circle C, the Ag shells can keep intact morphology and protect the Cu cores from oxidation. Whereas the original Cu particles will be oxidized at 150 circle C. In addition, the TG-Cu@AgCSPs are prepared as low-temperature conductive pastes to investigate their electrical properties. Compared with commercial Cu@Ag core-shell particles, the TG-Cu@AgCSPs possess more outstanding performance advantages and have the potential for commercial applications.