Degradation of silicone-based sealing materials used in microelectronics

被引：0
作者：
Mehr, Maryam Yazdan [1 ]
Hajipour, Pejman [2 ]
van Zeijl, H. [1 ]
van Driel, W. D. [1 ,4 ]
Cooremans, Thierry [3 ]
De Buyl, Francois. [3 ]
Zhang, G. Q. [1 ]
机构：
[1] Delft Univ Technol, Fac EEMCS, Mekelweg 4, NL-2628 CD Delft, Netherlands
[2] Univ Alberta, Chem & Mat Engn, Edmonton, AB T6G IH9, Canada
[3] Dow Silicones Belgium Sprl, Ind Zone C, B-7180 Seneffe, Belgium
[4] Signify, High Tech Campus, NL-5656 AE Eindhoven, Netherlands
来源：
2023 24TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS, EUROSIME | 2023年
基金：
荷兰研究理事会;
关键词：
D O I：
10.1109/EuroSimE56861.2023.10100796
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
引用
收藏
页数：4
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